ATS-02H-176-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.59°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-Heat Sinks are essential components in the cooling of many electronics devices, from computer processors and motherboards to LED bulbs and beyond. The ATS-02H-176-C2-R0 Heat Sink is a popular model used in a wide variety of applications due to its versatility, efficiency, and affordability. This article will discuss the application field and working principle of this thermal-heat sink.

Application Field of the ATS-02H-176-C2-R0 Heat Sink

The ATS-02H-176-C2-R0 Heat Sink is a versatile model suited for use in a variety of different application fields. In computers, it is used to help dissipate the thermal load created by the processor and other hardware components. The ATS-02H-176-C2-R0 is also suited for use in industrial applications, from telecommunications and medical equipment to solar installations. It has also been used in military and space applications, given its high-performance and low profile.

Working Principle of a Thermal-Heat Sink

The basic purpose of a Thermal-Heat Sink is to transfer and dissipate thermal energy. This is achieved through a combination of physical materials and mechanisms. The first step is to absorb and transfer the thermal energy generated by the device. The material of the thermal-heat sink is typically constructed from aluminum or copper, as both are excellent conductors of thermal energy. The Thermal-Heat Sink then transfers the thermal energy away from the device and dissipates it into the surrounding environment. The ATS-02H-176-C2-R0 also utilizes a combination of fins and pins, which serve as a support structure and drastically increase the surface area of the heat sink. This increases the efficiency of the heat sink, allowing it to transfer more thermal energy away from the device. Finally, the thermal-heat sink dissipates the thermal energy into the surrounding environment. It may do this passively, through convection, or actively, through forced air cooling. In the case of the ATS-02H-176-C2-R0, the thermal-heat sink actually utilizes both passive and active cooling. It utilizes large curved fins to passively dissipate thermal energy while also utilizing an internal fan to actively cool.

Conclusion

The ATS-02H-176-C2-R0 Heat Sink is a versatile model that can be used in a variety of different application fields. It is well suited for use in computers, industrial devices, military and space applications, and much more. Its efficient design utilizes a combination of fins and pins to dissipate thermal energy and utilizes both passive and active cooling methods. In conclusion, the ATS-02H-176-C2-R0 Heat Sink is an excellent choice for any thermal cooling application.

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