ATS-02H-192-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02H-192-C1-R0-ND

Manufacturer Part#:

ATS-02H-192-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X35MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02H-192-C1-R0 datasheetATS-02H-192-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.33°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal solutions in the industrial environment have become increasingly important due to the rise in global temperatures and the need to dissipate generated heat in a controlled manner. As such, heat sinks are now a central part of many applications, allowing the user to manage temperatures and prolong the life of hosting technology. ATS-02H-192-C1-R0 is a particularly efficient heat sink, designed to provide maximum heat dissipation in miniature spaces and prolong working life.

In its most simple form, a heat sink is an assembly of metals or alloys which transfer heat efficiently away from a hot device and disperse it into the surrounding environment. ATS-02H-192-C1-R0 is a high efficiency, miniaturized heat sink that fits into even the tightest of spaces. It features extruded aluminum fins that allow for cooling air to pass freely. This helps reduce air resistance, allowing more air to be drawn in and more efficiently dissipate the heat.

The ATS-02H-192-C1-R0 also utilizes a unique fin and tube design that allows heat to flow along a route that is as short as possible. This ensures that the heat generated by the device is quickly dissipated away and does not present a heat risk. The fin and tube design also helps maintain a cooler temperature across the device, prolonging the life of the device and ensuring that components stay cooler for longer. As temperatures increase, the fins act as a heat spreader and actively draw heat away from the device.

The ATS-02H-192-C1-R0 heat sink is particularly well-suited for applications where space is limited and heat dissipation is vital. Applications such as microprocessors, light emitting diodes, and power amplifiers all require a highly efficient heat sink to ensure their working life is not reduced. To assist in this, the ATS-02H-192-C1-R0 has several features that help to keep temperatures in check and improve the lifespan of devices.

Firstly, the shape of the heat sink allows it to fit into even the smallest of spaces without impeding air flow. Its unique fin and tube design allows for a short cooling route, so heat is dissipated quickly and efficiently. The design also helps create natural convection air flow, continuing the transfer of heat away from the device even when the unit is at rest. Finally, the heat sink has a highly conductive aluminum body which is specially designed to help create a strong thermal bond between the device and the heat sink itself.

In short, the ATS-02H-192-C1-R0 is a highly efficient and versatile thermal solution that can be used in a variety of applications. Its compact design allows it to fit into tight spaces and assist in cooling down devices quickly, helping to prolong working life. The unique fin and tube design also helps keep temperatures down and provides a natural convection air flow for better cooling performance. In addition, the highly conductive body of the heat sink maintains a strong thermal connection between the device and heat sink, allowing for better heat transfer.

The specific data is subject to PDF, and the above content is for reference

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