| Allicdata Part #: | ATS-02H-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-02H-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-02H-20-C1-R0 Application Field and Working Principle
Thermal & Heat Sinks are used to dissipate heat generated by various electrical or electronic components such as transistors, diodes, integrated circuits, wires, and cables. The ATS-02H-20-C1-R0 is a thermal and heat sink solution for various high-performance components, enabling them to be used in harsher conditions and higher temperatures.
Designed with a superior cooling profile, the ATS-02H-20-C1-R0 is able to provide uniform and efficient heat dissipation. Its construction consists of a heat sink base with fins and aluminum heat spreaders that are soldered together. These are designed to ensure the components, such as transistors, diodes, and integrated circuits, are better suited for use in high temperature environments.
The fins are strategically placed to provide maximum heat dissipation. Heat is spread out quickly and evenly on the base, which increases the cooling efficiency of the component. The base also has a spring mechanism, which ensures each component is secured and properly secured to the heat sink. This prevents slipping when heat is dissipated.
The ATS-02H-20-C1-R0 also features an optimized heat-sink with its own thermal pool. This allows heat to be absorbed and dissipated more efficiently, ensuring the component’s full load and performance. The thermal pool also helps to prevent thermal expansion, which can lead to component failure.
The aluminum heat spreaders are designed to provide superior thermal conductivity, which increases the effectiveness of the thermal transfer process. These heat spreaders help to efficiently dissipate heat away from components, which reduces the overall temperature of the heat sink. This helps reduce the load on the electronic components and increases their lifespan.
The ATS-02H-20-C1-R0 is a reliable cooling solution for high-performance components. Its superior design increases the efficiency of heat dissipation, while its thermal pool ensures components remain cool. With its robust construction and superior performance, the ATS-02H-20-C1-R0 is an ideal choice for any application where thermal performance is a priority.
The specific data is subject to PDF, and the above content is for reference