ATS-02H-204-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-02H-204-C3-R0-ND

Manufacturer Part#:

ATS-02H-204-C3-R0

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X12MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02H-204-C3-R0 datasheetATS-02H-204-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.58596
30 +: $ 3.38646
50 +: $ 3.18730
100 +: $ 2.98809
250 +: $ 2.78888
500 +: $ 2.58968
1000 +: $ 2.53987
Stock 1000Can Ship Immediately
$ 3.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.54°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are critical components utilized in the electronics industry to help dissipate heat and regulate temperature. The ATS-02H-204-C3-R0 is a standard thermal-heat sink that is used for a variety of purposes. This article will discuss the application field and working principle of the ATS-02H-204-C3-R0.The application field of the ATS-02H-204-C3-R0 primarily includes portable and embedded devices such as cellphones, tablets, and laptop computers. It is widely used in the consumer electronics industry to dissipate heat generated by the internal components of the devices, such as the processor, memory, and circuit board. By controlling the temperature inside the device, it prevents excessive heat from damaging the components, preserving the device’s stability and reliability.The working principle of the ATS-02H-204-C3-R0 is based on the process of convection. Heat is generated by the internal components of the device and transferred to the heat-sink via direct contact. The heat-sink then absorbs the heat from the source and transfers the heat away through a process of convection. As air moves over the surface of the heat-sink, it absorbs the heat and dissipates it, thus controlling the temperature of the device.The ATS-02H-204-C3-R0 provides a wide range of features to maximize its efficiency. It is constructed from a high-density aluminum alloy that provides excellent heat-dissipating properties. The surface area of the heat-sink has been specially designed to maximize its heat transfer capacity, thus providing superior cooling performance. Additionally, the heat-sink has a PED Certification which ensures its conformity to safety and quality standards.Finally, the ATS-02H-204-C3-R0 is designed to be highly versatile and able to be mounted in a variety of orientations. This allows the heat-sink to be used in a multitude of applications and gives it the flexibility to fit in a variety of design schemes.Overall, the ATS-02H-204-C3-R0 is a standard thermal-heat sink that is used in a wide variety of consumer electronics applications, such as cell phones, tablets, and laptop computers. It works on the principle of convection, using a high-density aluminum alloy to maximize its efficiency and and a specially designed surface to maximize its heat transfer capacity. The ATS-02H-204-C3-R0 is also designed to be highly versatile and able to be mounted in a variety of orientations.

The specific data is subject to PDF, and the above content is for reference

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