ATS-02H-23-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02H-23-C1-R0-ND

Manufacturer Part#:

ATS-02H-23-C1-R0

Price: $ 4.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02H-23-C1-R0 datasheetATS-02H-23-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.81717
30 +: $ 3.60507
50 +: $ 3.39293
100 +: $ 3.18087
250 +: $ 2.96881
500 +: $ 2.75675
1000 +: $ 2.70374
Stock 1000Can Ship Immediately
$ 4.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-02H-23-C1-R0 is a thermal solution for managing and dissipating the heat generated by modern electrical and mechanical systems. It is generally classified as a heat sink, which means that its primary purpose is to absorb and dissipate the heat generated by the system and prevent it from continuing to build up and become dangerous. The ATS-02H-23-C1-R0 is a heat sink specifically designed for medium- to high-powered electrical applications, making it an ideal choice for a wide range of electromechanical applications.

An ATS-02H-23-C1-R0 consists of an array of metal fins arranged in a grid-like pattern. The fins are connected to a base plate, which in turn is attached to the device that is creating the heat. The fins act as a sort of heat sink, trapping and absorbing the heat created by the device and slowly dissipating it away from the device. The fins are designed to be both efficient and lightweight, allowing them to easily be moved and adjusted if necessary. The base plate also serves as an insulator, preventing the heat from transferring to other components of the system while still allowing for efficient transfer of heat away from the device.

The fins and base plate are usually crafted from a high-performance metal alloy that is able to handle high amounts of heat without becoming damaged. The fins can also be constructed out of various other materials such as aluminum or stainless steel depending on the exact specifications of the application. In addition, the fins come in different styles and sizes to best fit the purpose they are needed for.

Once the heat sink is installed, the system works by transferring the heat generated by the device to the fins, which then dissipate it away as the ambient temperature air passes by. This natural airflow is enhanced by the fins\' shape, which increase the surface area available for heat transfer. The fins are also designed to be lightweight yet sturdy, allowing them to conform to the shape of the device and its surroundings.

ATS-02H-23-C1-R0 heat sinks are commonly used in high-powered computers, server racks, and industrial machines. They are also ideal for applications where space and weight restrictions are a concern, such as in aerospace and defense applications. The ATS-02H-23-C1-R0 is an ideal solution for managing and dissipating the heat generated by modern electrical and mechanical systems.

The specific data is subject to PDF, and the above content is for reference

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