| Allicdata Part #: | ATS-02H-24-C1-R0-ND |
| Manufacturer Part#: |
ATS-02H-24-C1-R0 |
| Price: | $ 4.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-24-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.08303 |
| 30 +: | $ 3.85623 |
| 50 +: | $ 3.62943 |
| 100 +: | $ 3.40257 |
| 250 +: | $ 3.17573 |
| 500 +: | $ 2.94889 |
| 1000 +: | $ 2.89218 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are essential components in modern electronic devices, since they help to dissipate heat that would otherwise accumulate and damage sensitive components. The ATS-02H-24-C1-R0 is a heat sink designed for use in demanding electronic applications. This article will cover the ATS-02H-24-C1-R0\'s application field and working principle.
Application Fields
The ATS-02H-24-C1-R0 is suitable for use in CPUs, digital signal processors (DSPs) and other high-performance IC chips. Its size and mounting options make it useful for a variety of applications, including consumer electronics, communication equipment and automotive electronics. The heat sink is made of aluminum and is designed to dissipate up to 8 W of heat. It is also resistant to corrosion, which makes it suitable for use in humid or salty conditions.
Mounting Options
The ATS-02H-24-C1-R0 can be mounted in several different ways. The two most common mounting methods are through-holes and surface-mounting. In the through-hole method, the heat sink is mounted to the printed circuit board using screws, nuts, and washers. The surface-mounting method utilizes two or four screws that attach the heat sink directly to the circuit board. This mounting method requires a high level of precision, since the screws must align perfectly with the board.
Working Principle
The ATS-02H-24-C1-R0 works by dissipating heat away from its attached components. To do this, it features several heat-dissipating fins that increase the contact area between the heat sink and the air. The fins help to spread out the heat more efficiently, which increases the heat dissipation capacity of the heat sink. The thermal resistance of the ATS-02H-24-C1-R0 is 0.14℃/W, which makes it well-suited for high-temperature applications.
The fins of the ATS-02H-24-C1-R0 are designed to maximize the contact area with the surrounding air, thus improving cooling performance. The fins are also angled to ensure that the air flow is uninterrupted. Additionally, the heat sink is designed to have low parasitic inductance, which allows it to transfer heat to the air more quickly. This improves the cooling efficiency of the heat sink, thus allowing it to efficiently dissipate larger amounts of heat.
The ATS-02H-24-C1-R0 is rated for -40℃ to +90℃ operating temperatures and 2 g vibration resistance. This makes it suitable for use in industrial applications. The heat sink is also lightweight and easy to install, which makes it an ideal choice for integrated circuits and other high-power electronics.
Conclusion
The ATS-02H-24-C1-R0 is a high-performance heat sink suitable for a variety of electronic applications. Its design features an increased contact area with the air to efficiently dissipate heat. Its lightweight design and mounting options make it an ideal choice for CPUs, DSPs and other IC chips. The ATS-02H-24-C1-R0 is also rated for a wide range of temperatures and vibration resistance, making it suitable for use in harsh industrial environments.
The specific data is subject to PDF, and the above content is for reference