
Allicdata Part #: | ATS-02H-32-C2-R0-ND |
Manufacturer Part#: |
ATS-02H-32-C2-R0 |
Price: | $ 5.81 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 5.22837 |
30 +: | $ 4.93773 |
50 +: | $ 4.64726 |
100 +: | $ 4.35683 |
250 +: | $ 4.06637 |
500 +: | $ 3.77592 |
1000 +: | $ 3.70330 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Rectangular, Fins |
Length: | 2.280" (57.90mm) |
Width: | 1.450" (36.83mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.450" (11.43mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks provide heat dissipation solutions for electronics by transferring heat away from hot spots and help maintain a safe temperature for the components. One of the most efficient and reliable options available in the market is ATS-02H-32-C2-R0. It is a two-stage, high heat sinking compound with exceptional performance levels.
This compound is widely used in high-end applications such as military, aerospace, industrial and medical application fields due to its superior thermal performance. It is made up of a combination of aluminum oxide, aluminum nitrite and other components that offer superior thermal conductivity, shock and vibration resistance. Additionally, it has low outgassing and low toxicity properties as well.
ATS-02H-32-C2-R0 is a versatile product that can be used in various temperature control applications. It can be used as a heat sink to reduce the operating temperature of power transistors, or as a thermal interface material to dissipate heat with a large thermal coefficient. It can also be used as a system-level thermal interface material to manage heat transfer across multiple components, or as an optimized thermal solution in direct contact with the heat-generating component.
One of the most impressive features of ATS-02H-32-C2-R0 is its high thermal conductivity. It achieves a thermal conductivity of 42 W/mK which is much greater than other common thermal materials such as silicone and graphite. This makes it ideal for applications where heat needs to be dissipated quickly and efficiently from hot components.
ATS-02H-32-C2-R0 is also designed with an easy application. It is supplied as a two-part paste and requires only a simple mix-and-apply procedure that can be used in any kind of application. The main advantage of using compound is that it can provide high thermal performance without needing a large volume or thick designs.
Finally, ATS-02H-32-C2-R0 is also designed to be very reliable and durable. It can withstand temperatures up to 500°C and offers excellent thermal shock resistance, meaning it is suitable for long-term application environments that experience frequent temperature changes. In addition, it offers consistent performance from batch to batch for maximum reliability.
In conclusion, ATS-02H-32-C2-R0 provides excellent thermal performance and is suitable for a wide range of applications. Its superior thermal conductivity, shock resistance and durability make it an ideal choice for various temperature control applications in military, aerospace, industrial and medical industries. It is also designed with an easy installation process and offers reliable performance for long-term operation.
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