ATS-02H-43-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-02H-43-C3-R0-ND

Manufacturer Part#:

ATS-02H-43-C3-R0

Price: $ 3.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X10MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02H-43-C3-R0 datasheetATS-02H-43-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.01959
30 +: $ 2.93790
50 +: $ 2.77477
100 +: $ 2.61154
250 +: $ 2.44831
500 +: $ 2.36669
1000 +: $ 2.12187
Stock 1000Can Ship Immediately
$ 3.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 29.12°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Overview of Thermal - Heat Sinks

Thermal - Heat Sinks are specialized pieces of hardware used to dissipate the heat produced by electronic components during operation. Heat Sinks employ a variety of strategies – including providing direct contact with a fin material, enhanced convective and radiative cooling, and heat-breaking fins – to transfer excess heat away from sensitive components. The most common type of Heat Sink is the finned-type, which uses a large array of fin material with an airflow channel between each fin to direct air away from hot components. Heat Sinks are used in a wide range of applications, from computer chipsets to industrial machines.

The ATS-02H-43-C3-R0 Heat Sink

The ATS-02H-43-C3-R0 Heat Sink is a specialized finned-type Thermal Heat Sink manufactured by Advanced Thermal Solutions (ATS). The product is designed for use in high-performance electronics where minimal cooling requirements are necessary. The ATS-02H-43-C3-R0 Heat Sink is an efficient yet cost-effective solution for cooling critical components.The ATS-02H-43-C3-R0 Heat Sink is an elongated fin type heat sink constructed from extruded aluminum. It features two metal meshes, each measuring 4" in length, and a single round inlet vent on the bottom. The product is designed to draw in air from the surrounding environment, allowing for extreme cooling efficiency. The cooling fins are designed to be highly efficient in dissipation of heat while providing excellent air flow across the component being cooled.

Application Field and Working Principle

The ATS-02H-43-C3-R0 Heat Sink is ideally suited for use in high-performance applications, such as overclocked gaming PCs, servers, and workstations. The product is also suitable for use in industrial equipment, medical devices, and other electronics where efficient heat dissipation is paramount.The working principle of the ATS-02H-43-C3-R0 Heat Sink is simple. The elongated fins draw air in from the surrounding environment, rapidly cooling components mounted on them without fail. The large number of fins ensure efficient heat dissipation, with more surface area to dissipate heat. The mesh grooves function to redirect incoming air away from hot components, resulting in greater cooling efficiency. The main advantage of the ATS-02H-43-C3-R0 Heat Sink is its ability to dissipate heat quickly and reliably – ensuring that components remain safe and cool. Additionally, as most Heat Sinks of this type use a fanless design, they are maintenance-free and consume very little power, making them ideal for energy-conscious solutions.

Conclusion

The ATS-02H-43-C3-R0 Heat Sink is an efficient and cost-effective Thermal Heat Sink that is well-suited for high-performance electronics. The product is designed with an efficient cooling fin design, mesh grooves, and an overall light-weight and low-profile construction. The product is ideally suited for use in overclocked gaming PCs, servers, workstations, and other electronics that require reliable and low-maintenance thermal management.

The specific data is subject to PDF, and the above content is for reference

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