ATS-02H-55-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02H-55-C1-R0-ND

Manufacturer Part#:

ATS-02H-55-C1-R0

Price: $ 3.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X10MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02H-55-C1-R0 datasheetATS-02H-55-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.92446
30 +: $ 2.84550
50 +: $ 2.68733
100 +: $ 2.52926
250 +: $ 2.37119
500 +: $ 2.29216
1000 +: $ 2.05503
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 23.94°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

Heat sink devices are used to dissipate the heat generated by certain equipment or components in order to maintain an optimal temperature range. Heat sinks are commonly found in electronics such as computers and consumer appliances. The ATS-02H-55-C1-R0 is a thermal-heat sink designed to cool electronics in applications where a high level of thermal performance is needed.

ATS-02H-55-C1-R0 Application Field:

The ATS-02H-55-C1-R0 is designed for application in computer systems, medical imaging systems, gaming consoles, industrial control systems, and other high-end electronics. It is designed for high-performance cooling to ensure that the equipment runs reliably and at peak performance.

ATS-02H-55-C1-R0 Working Principle:

The ATS-02H-55-C1-R0 is a passive heat sink device which operates through a process of convection and dissipation. When the heat sink is installed on a device, it works by taking advantage of the natural flow of heat away from the element. The heat is dissipated through the fins of the heat sink which have been specially designed to create an optimum air flow. This air flow then dissipates the heat away from the device, allowing for an efficient cooling solution.

The ATS-02H-55-C1-R0 heat sink utilizes aluminum fins for superior thermal performance and dissipates heat away from the device quickly and effectively. In addition, a frequency-specific heat pipe is used for better cooling efficiency. The heat pipe features a perforated design which improves air flow and maintains an optimum temperature level throughout the device.

The ATS-02H-55-C1-R0 heat sink also features fanless cooling, allowing equipment to stay silent and run efficiently at the same time. Its superior thermal performance and reliability makes it the perfect cooling solution for high-end electronics. With its powerful thermal performance and fanless operation, the ATS-02H-55-C1-R0 is the ideal choice for cooling sensitive electronics that require reliable performance.

The specific data is subject to PDF, and the above content is for reference

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