| Allicdata Part #: | ATS-02H-58-C1-R0-ND |
| Manufacturer Part#: |
ATS-02H-58-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-58-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal–heat sinks are an important part of modern electronics, typically used in computers, mobile phones, and other electronic devices. Thermal–heat sinks are used to transfer heat away from a hot component, allowing the component to stay at a lower temperature, avoiding overheating or damage due to heat.
The ATS-02H-58-C1-R0 is a thermal-heat sink designed for high-frequency applications, such as actively cooled antenna systems. It offers superior thermal performance with a larger surface area for improved performance. The part is designed with an optimized curved-fin design, which offers superior thermal conductivity, and a high degree of uniformity in heat transfer. The design ensures improved cooling efficiency, while reducing the overall size of the component.
The ATS-02H-58-C1-R0 features a brushed aluminum base with four curved fins. The aluminum base provides superior thermal properties, as well as a strong thermal connection to the rest of the system. The four curved fins are designed to increase the surface area of the heat sink, providing a larger area for heat transfer. This helps to dissipate more heat from the component, keeping it cooler and avoiding damage.
The ATS-02H-58-C1-R0 is designed to operate in a high-frequency environment, where relatively small amounts of power are needed to keep the component running. This design is suitable for antenna systems and other applications where heat dissipation is required. The ATS-02H-58-C1-R0 is perfect for mobile phones, computers, and other devices that generate large amounts of heat due to their processing power.
In order to operate effectively, the ATS-02H-58-C1-R0 must be installed correctly. The device should be securely mounted to the main PCB board, ensuring that all thermal paths are evenly distributed throughout the system. In addition, the area around the device must be free of any other obstructions, allowing the heat to dissipate without any obstructions.
In order to ensure that the device is functioning correctly, the manufacturer’s instructions must be followed closely. This includes verifying that the correct installation spacing is being used, and making sure that all of the materials are properly secured in place. If correctly installed, the ATS-02H-58-C1-R0 will provide superior thermal performance, keeping the device running at a safe temperature.
The ATS-02H-58-C1-R0 is an excellent thermal-heat sink, designed with both active cooling and passive cooling in mind. It is perfect for antenna systems and other applications that require superior heat dissipation. With a brushed aluminum base, four curved fins, and optimized spacing, it provides excellent thermal performance, helping to keep components running cooler and avoiding damage due to overheating.
The specific data is subject to PDF, and the above content is for reference