| Allicdata Part #: | ATS5773-ND |
| Manufacturer Part#: |
ATS-02H-64-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-64-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an integral part of any electronic device. Heat sinks are one of the most common and basic solutions used in electronic device thermal management. The ATS-02H-64-C2-R0 is one of the highest quality thermal solutions available on the market today. This article will discuss the application field and working principle of the ATS-02H-64-C2-R0 thermal heat sink.
The ATS-02H-64-C2-R0 is a highly advanced aluminum-finned heat sink that utilizes an efficient direct contact heat transfer method to reduce the temperature of integrated circuit devices. It is designed to regulate the temperature within electronic devices and keep useful electronic components from becoming damaged due to excessive heat. This heat sink is made from aluminum which conducts heat very effectively, allowing it to reduce the surface temperature of circuit boards and other components.
The ATS-02H-64-C2-R0 is designed specifically for small to medium sized electronic devices. It is ideal for use in CPU cooling applications, hard disks, televisions, and other devices which require an effective thermal heat sink to reduce temperatures and prevent component malfunctions. The heat sink is also designed to minimize space usage. Its simple design allows the installation of more components in less space.
The working principle of the ATS-02H-64-C2-R0 is based on efficient heat transfer. Heat is drawn away from components through a copper heat plate which is connected to the heat sink. During operation, this heat plate absorbs and radiates heat away from the component using the fins of the heat sink and convection cooling through air passing around the fins. At the same time, the copper heat plate also absorbs heat from the environment and radiates heat to the air.
The ATS-02H-64-C2-R0 also features a two-stage shunt flow system which helps to ensure efficient heat transfer. This system features an inlet passageway which draws in air to the heat sink, and an outlet passageway which directs the airflow away from the heat sink. The combination of these two systems ensures a constant flow of cool air onto the component and prevents the accumulation of heat within the heat sink.
In conclusion, the ATS-02H-64-C2-R0 is a highly advanced aluminum-finned heat sink with a two-stage shunt flow system. It is designed to cool small to medium sized electronic devices and reduce the temperature of integrated circuit devices. Its efficient direct contact heat transfer method helps to reduce the surface temperature of circuit boards and other components. The ATS-02H-64-C2-R0 is a reliable and efficient thermal solution that ensures components are cooled and protected from damage or malfunction due to excess heat.
The specific data is subject to PDF, and the above content is for reference