| Allicdata Part #: | ATS-02H-71-C1-R0-ND |
| Manufacturer Part#: |
ATS-02H-71-C1-R0 |
| Price: | $ 4.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-71-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.84048 |
| 30 +: | $ 3.62691 |
| 50 +: | $ 3.41347 |
| 100 +: | $ 3.20015 |
| 250 +: | $ 2.98680 |
| 500 +: | $ 2.77346 |
| 1000 +: | $ 2.72012 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.67°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are common pieces of thermal-related hardware, and when it comes to industrial applications, the ATS-02H-71-C1-R0 model stands out as a reliable and versatile choice. This heat sink combines two distinct technologies, finned and foamed copper, that make it ideal for any environment that requires high levels of heat dissipation.
The ATS-02H-71-C1-R0 model consists of an array of copper plates with fins, which are stacked cold to improve heat sink surface area. The copper plates are up to 5mm high and are arranged with small spaces between them, which increases the finned area for better cooling performance while also increasing the air movement. As the assembly is finished, a foamed copper layer is applied to the top of the arrangement. This part of the design is based on the concept of heat pipes, where the foamed copper layer acts as a heat transfer surface. The two primary components of the heat sink conspire to deliver an improved thermal solution that is well-suited to a wide range of industrial applications.
The most important feature of the ATS-02H-71-C1-R0 model is its ability to dissipate high levels of heat in limited space. Due to its efficient design, the heat sink can effectively cool down up to 90Watts of power in a surface area of just 19cm x 19cm. This high level of performance is often important for applications such as computers, servers, communication, and industrial machinery that often require devices to be cooled without taking up too much valuable space.
The benefits of the ATS-02H-71-C1-R0 model are further enhanced by its sleek styling. With a thickness of just 6mm, the assembly is slim enough to fit into the tightest of spaces. This same depth also ensures compatibility with a wide range of mounting options, enabling the heat sink to be placed in virtually any area. The model is also available with optional dimpled or anodized aluminum cover plate that provides substantial additional protection in any enclosed environment.
The ATS-02H-71-C1-R0 model is an ideal choice for any high-performance embedded environment, as its thermal performance combined with versatile design make it suitable for a variety of applications. Whether used in computers, servers, or communications equipment, its efficient finned and foamed copper design is capable of functioning well in any environment that requires high levels of heat dissipation.
The specific data is subject to PDF, and the above content is for reference