ATS-02H-73-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02H-73-C1-R0-ND

Manufacturer Part#:

ATS-02H-73-C1-R0

Price: $ 3.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02H-73-C1-R0 datasheetATS-02H-73-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.81736
30 +: $ 2.74134
50 +: $ 2.58905
100 +: $ 2.43671
250 +: $ 2.28446
500 +: $ 2.20830
1000 +: $ 1.97985
Stock 1000Can Ship Immediately
$ 3.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 28.78°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are used to dissipate heat from objects that generate a significant amount of heat. The ATS-02H-73-C1-R0 heat sink is one such type, and it is designed for use in either air or liquid cooled applications. The specific thermal resistance ranges from 0.6°C/W to 2.15°C/W depending on the specific application.

The ATS-02H-73-C1-R0 heat sink is a two-piece system, with the main body being a thin sheet metal that is stamped and formed into a unique shape. This shape helps to maximize air or liquid flow, depending on the type of cooling system being used, resulting in improved thermal efficiency. A thermal interface material (TIM) is then applied to the heat spreader, which helps to increase the surface area that is available for heat dissipation.

The other major component of the ATS-02H-73-C1-R0 heat sink are a series of fins. These fins are designed to maximize contact with the air or liquid flow, resulting in improved thermal conductivity. The fins are stamped from a high quality aluminum sheet or aluminum alloy material, and can be finished in either anodized black or a natural aluminum finish.

When using the ATS-02H-73-C1-R0 heat sink, it is important to consider the application that it is intended for. If the application requires a significant amount of airflow, then an air-cooled system should be used. On the other hand, if there is not much airflow available, then a liquid-cooled system may be the best option.

The ATS-02H-73-C1-R0 provides excellent heat sinking efficiency regardless of the type of cooling system being used. Its design ensures that heat is dissipated quickly and efficiently, allowing components to run cooler and more efficiently while improving their overall lifespan. In addition, it can be used in a variety of applications, from CPUs to GPUs and other electronic devices where heat dissipation is a concern.

Overall, the ATS-02H-73-C1-R0 heat sink is an excellent choice for those looking for a reliable and efficient thermal solution. Its unique design ensures efficient heat dissipation regardless of the type of cooling system being used, and its low thermal resistance ranges aid in the cooling of components. Whether used in air or liquid cooled systems, the ATS-02H-73-C1-R0 provides excellent performance and a durable, long-lasting thermal solution.

The specific data is subject to PDF, and the above content is for reference

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