| Allicdata Part #: | ATS5818-ND |
| Manufacturer Part#: |
ATS-03A-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03A-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03A-10-C2-R0 heatsink is designed as a thermal solution for modern electronics. It is a budget-friendly model that is designed to dissipate heat quickly and effectively, while providing a reliable and attractive design.
The heatsink is constructed with aluminum alloy, which has several properties that make it an ideal choice for a heatsink material. Aluminum alloy is lightweight but strong, cost effective, and highly thermally conductive, making it ideal for dissipating large amounts of heat in a limited space. It is also corrosion resistant.
The ATS-03A-10-C2-R0 heatsink utilizes an extrusion process to create fins that are tightly and uniformly spaced. The fins are then cut into shape using CNC machines, making the fins perfectly sized and spaced for maximum heat transfer efficiency. Additionally, the heatsink is designed with a base structure that enhances the efficient transfer of heat from the electronics to the fins.
The heatsink makes use of the concept of convection cooling. This means that the fins are designed in a way that air is able to be drawn through the fins, around the electronics, and then away from the heatsink. This allows for air to draw heat away from the electronics much more quickly and efficiently than if the heatsink was simply relying on conduction alone.
The ATS-03A-10-C2-R0 is ideal for low-power and medium-power applications, as it is able to dissipate up to 25 watts of heat. It is most commonly used in applications where speed and accuracy is key, such as sophisticated electronic controls, industrial controllers, communication hardware, laser systems, and medical devices.
In addition, the ATS-03A-10-C2-R0 can be easily installed in a variety of locations and configurations. It has a standard mounting hole pattern, meaning that it can be easily mounted onto a variety of types of heatsink chassis or motherboards. It can also be used in conjunction with a fan for even greater cooling performance.
Overall, the ATS-03A-10-C2-R0 is a highly efficient and reliable thermal solution that can provide excellent cooling performance for a variety of electronics projects. With its lightweight construction, corrosion resistant aluminum alloy, and its ability to dissipate up to 25 watts of heat, it is an excellent choice for both low-power and medium-power applications.
The specific data is subject to PDF, and the above content is for reference