| Allicdata Part #: | ATS-03A-126-C1-R0-ND |
| Manufacturer Part#: |
ATS-03A-126-C1-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03A-126-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
In the thermal management of electronics, the ATS-03A-126-C1-R0 is a significant development in heat sink technology for electronic devices, providing an efficient thermal solution while ensuring reliable and durable performance. Heat sinks are an important part of the thermal management system. Heat sinks absorb and dissipate the heat generated by the electronic components during operation, thus helping to keep the equipment running reliably and without overheating. Heat sinks act as a dissipater of heat from the electronics and can be used in various scenarios from desktop computers to industrial machinery and military systems.
The ATS-03A-126-C1-R0 is a single-side heat sink with a unique design, developed to effectively absorb and dissipate the heat generated by nearby electronic components. It’s able to operate in a wide temperature range, up to a maximum of 120°C, and can be used with a variety of different thermal interfaces.
Design and Construction
The ATS-03A-126-C1-R0 is constructed using an aluminium alloy, with the heat dissipation fins optimized for maximum surface area to facilitate efficient cooling. It is designed to attach to any suitable mounting plane. A recessed indent allows for an easy fit, whilst still providing an efficient thermal connection to the mounting plane. The integral heat sink fins are divided into two sections: the outer section increases the thermal efficiency by reducing the coolant flow resistance, while the inner section provides thermal veiling to reduce the stress on the heat dissipating fins, thus improving its thermal performance.
Application Field
The ATS-03A-126-C1-R0 has a wide range of applications, particularly in electronic devices where thermal management is a significant concern. It can be used in computers, industrial machinery, and military systems. Additionally, the ATS-03A-126-C1-R0 can be used as a cooling solution for electronics in automotive, telecommunications, and aerospace industries. Furthermore, its thermal properties make it suitable for hot environments such as in cooling of high power LEDs.
Working Principle
The ATS-03A-126-C1-R0 works by transferring heat generated from the electronic components away from the component and into the heat sink. The heat is absorbed into the heat sink and spread out over a large surface area, which helps to spread the heat and lower the temperature. The heat sink fins are designed to help disperse the heat more efficiently. This is achieved by increasing the surface area of the heat sink so that more heat can be transferred away from the component, whilst increasing the volume of air in contact with the fins to help dissipate the heat more quickly. When the heat is transferred away from the component and into the fins, it is then dissipated into the surrounding environment. This process is repeated until the temperature of the component is reduced to an acceptable level.
Aside from providing an efficient thermal solution, the ATS-03A-126-C1-R0 heat sink is also designed to be low maintenance. This means that it does not require any regular maintenance or replacement of thermal grease or thermal pads. It is also designed to be low profile, meaning that it is not an obstruction to other components or devices, allowing for tight placement in tight spaces. This makes it ideal for use in densely-packed electronics.
Conclusion
The ATS-03A-126-C1-R0 is a superior thermal solution for electronics and other devices. Its design allows for efficient heat absorption and dissipation, whilst its low profile allows for easy and discreet installation in most spaces. Due to its durability and reliability, it is suitable for a wide range of different applications in a variety of different environments. With its unique design, the ATS-03A-126-C1-R0 offers an ideal option for those looking for a reliable and efficient thermal solution.
The specific data is subject to PDF, and the above content is for reference