Allicdata Part #: | ATS-03A-176-C1-R0-ND |
Manufacturer Part#: |
ATS-03A-176-C1-R0 |
Price: | $ 3.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X15MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-03A-176-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.13866 |
30 +: | $ 3.05361 |
50 +: | $ 2.88401 |
100 +: | $ 2.71435 |
250 +: | $ 2.54470 |
500 +: | $ 2.45987 |
1000 +: | $ 2.20541 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.590" (15.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 8.56°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal-Heat sinks are an essential component of all electronic and electrical systems that require cooling. Heat sink designs range from simple to complex, depending on the size, complexity, and cooling capabilities needed for a device or system. The ATS-03A-176-C1-R0 is a popular thermal heat sink that is used extensively in applications where a reliable source of heat dissipation is required.
The ATS-03A-176-C1-R0 is a medium sized, aluminum alloy based heat sink with a specifically designed profile. It is easy to install and has excellent thermal performance characteristics with a maximum thermal power dissipated of 2W/cm2. The specific profile of this heat sink increases air flow around its surface, providing an effective route for heat to be transferred to the ambient air. The thermal resistance of the ATS-03A-176-C1-R0 ranges from 0.3 to 0.5°C/W, with an overall performance that is superior to that of other comparable heat sinks.
The ATS-03A-176-C1-R0 is suitable for use in applications ranging from very small, low thermal loads to medium and high power density loads. In addition, this heat sink has a wide range of application fields, including consumer electronics, telecoms, medical, and industrial applications. It is also suitable for devices that require additional cooling due to their physical size, such as laptops, tablet PCs and other electronic devices.
The main working principle behind the ATS-03A-176-C1-R0 is that of thermal conduction. When heat is generated within a device or system it will be conducted along a path that is determined by the materials present. In the case of the ATS-03A-176-C1-R0 heat generated within the system or device will be conducted throughout the entire surface area of the heat sink. The aluminum alloy of the heat sink quickly absorbs the heat and directs it to the air surrounding the sink. The ambient air then absorbs the heat dissipated from the heat sink, allowing it to be effectively transferred away from the system or device.
The ATS-03A-176-C1-R0 thermal-heat sink is capable of providing effective cooling solutions in a variety of electrical or electronic applications. It is easy to install, flexible in its application, and is reliable in performance. This makes the ATS-03A-176-C1-R0 an ideal choice for any system that requires a source of reliable and efficient cooling.
The specific data is subject to PDF, and the above content is for reference