ATS-03A-195-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.88°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-03A-195-C1-R0 Heat Sink is a thermoelectric cooling module that is designed to maintain a certain temperature in its system. It is a reliable and efficient way to dissipate heat from sensitive electronic components. The module is constructed from a base plate and a top plate, and thermally insulated by 0.15mm thick alternate layers of aluminum and graphite insulation. The bakelite is then honeycomb laminated for even heat transfer and efficient cooling.The working principle of the ATS-03A-195-C1-R0 Heat Sink is based on a thermoelectric effect. A thermoelectric effect is the generation of power or the ability to transfer electrical power through the use of thermal gradients. This particular Heat Sink works through a heat exchanger consisting of two plates; when these plates are kept at different temperatures with respect to each other, the greater temperature will cause the transfer of energy to the cooler plate. This process is called the Peltier effect.The ATS-03A-195-C1-R0 Heat Sink module has a variety of applications such as in power supplies for telecommunications systems, embedded control systems, computers, server systems and other electronic components. It can be used for active cooling in electronic control and power electronics due to its low thermal resistance, efficiency and reliability. The Heat Sink is also suitable for thermal management in industrial and automotive systems, providing efficient thermal control and a long life expectancy.The ATS-03A-195-C1-R0 Heat Sink has several advantages that make it an ideal choice for a range of applications. It is stable due to its tight tolerances, strong construction and excellent thermal resistance. The Heat Sink has a high-efficiency, which allows environmental temperature fluctuations to be compensated efficiently and reduces the electrical power consumption and CO2 emissions. It also offers reliable thermal solutions in a number of different fields, including automotive electronics, medical electronics, telecommunications, computer hardware, and consumer electronics.The ATS-03A-195-C1-R0 heat sink is a reliable and efficient way to dissipate heat from delicate electronic components and systems. It works through the thermoelectric effect of transferring energy between two plates kept at different temperatures. The Heat Sink has a range of applications including in power supplies for telecommunications systems, embedded control systems, computers, server systems, automotive electronics, medical electronics, telecommunications, consumer electronics, and other electronic components. It has a number of advantages such as stable construction, tight tolerances, excellent thermal resistance, and high efficiency.

The specific data is subject to PDF, and the above content is for reference