
Allicdata Part #: | ATS-03A-210-C3-R0-ND |
Manufacturer Part#: |
ATS-03A-210-C3-R0 |
Price: | $ 6.57 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 70X70X12MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 5.91066 |
30 +: | $ 5.58222 |
50 +: | $ 5.25395 |
100 +: | $ 4.92553 |
250 +: | $ 4.59716 |
500 +: | $ 4.26879 |
1000 +: | $ 4.18670 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.756" (70.00mm) |
Width: | 2.756" (70.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.472" (12.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 5.24°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat sinks are an integral part of the cooling systems used in many electronic devices. They are designed to dissipate heat in order to maintain optimal device temperature, helping to prevent overheating and possible failure of the device. The ATS-03A-210-C3-R0 heat sink is one such product, and as such it’s important to understand how it works and what it is used for.
The ATS-03A-210-C3-R0 is a thermal package which is suitable for several applications. It is designed with a mid-level of performance and is ideal for applications such as Distributed Antenna Systems (DGS), Internet of Things (IoT), and Low profile LED lighting. This heat sink is a cost-effective solution for these applications, offering significant thermal performance at lower cost than more industrial grade heatsinks.
The core of the thermal system is the ATS-03A-210-C3-R0 heat sink, which is designed with a series of fins to increase its surface area and more efficiently remove heat away from the device. These fins help to increase the surface area of the sink, which improves its ability to draw heat away from the device. The fins are complimented with an aluminum base, which helps disperse the heat away from the sink. All of these parts work together to efficiently remove heat away from the device and out into the surrounding environment.
The ATS-03A-210-C3-R0 is designed to work in conjunction with a fan to further increase the air flow and cooling efficiency. The fan is located near the base of the heat sink and helps to draw cooler air in from the outside and push the warmer air away from the device. This process helps to maintain the optimal operating temperature of the device, protecting it from overheating and potential failure.
In addition to its fan, the ATS-03A-210-C3-R0 also features a variety of mounting options. The heat sink comes with several standard mounting peg-type brackets, which can be used to attach it to the device. These brackets are designed to ensure a secure and robust mounting, which helps to maximize the heat transfer away from the device.
Finally, the ATS-03A-210-C3-R0 is designed to work with a range of different devices. It is compatible with a variety of different circuit boards, meaning it can be used for a range of different applications. This makes it a great choice for a variety of different special applications.
In conclusion, the ATS-03A-210-C3-R0 heat sink is a great option for applications which require effective thermal management. Its combination of efficient fins and fan help to effectively remove heat away from the device, while its mounting peg-type brackets ensure a secure and robust mounting. Additionally, its compatibility with a range of different devices makes it a great choice for different applications. All of these factors make the ATS-03A-210-C3-R0 an attractive option for those looking for a cost-effective solution for their thermal management needs.
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