ATS-03A-32-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-03A-32-C3-R0-ND

Manufacturer Part#:

ATS-03A-32-C3-R0

Price: $ 5.66
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X11.43MM T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03A-32-C3-R0 datasheetATS-03A-32-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.08914
30 +: $ 4.80669
50 +: $ 4.52390
100 +: $ 4.24116
250 +: $ 3.95842
500 +: $ 3.67567
1000 +: $ 3.60499
Stock 1000Can Ship Immediately
$ 5.66
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.54°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important consideration in many applications, and heat sinks are regularly deployed to help dissipate excess heat. The ATS-03A-32-C3-R0 is an efficient and durable thermal solution that combines a heatsink’s cooling power and a fan’s air circulation. This allows it to quickly and quietly cool even the most demanding applications.

Overview of ATS-03A-32-C3-R0 Heat Sink

The ATS-03A-32-C3-R0 is a stainless steel, aluminum, and carbon-based heat sink and fan combination. It is designed for use in high-performance, high-demand industries, and offers superior thermal management solutions. The ATS-03A-32-C3-R0 features three distinct thermal systems, each with its own unique advantages.

Direct Thermal System

The first system is the direct thermal system. This system is the most efficient in terms of heat transfer, as it transfers heat directly to the heatsink’s surface without the need for fans or pumps. The direct thermal system is ideal for cooling large-scale applications, such as those found in servers and data centers.

Heat Pipe System

The second system is the Heat Pipe system. This system features a series of copper pipes that are filled with a liquid coolant. As air passes by the pipes, the heat is transferred to the liquid and subsequently dissipated off the heatsink. This system is a reliable solution for managing larger amounts of heat, and is more appropriate for applications that require robust cooling capacity.

Fan System

The third system is the Fan system. This system features a series of fans that actively circulate air across the heatsink’s surface. This allows for shorter cooling times and more efficient heat dissipation. This is the best solution for applications that require faster cooling and/or more efficient fan control.

Applications of the ATS-03A-32-C3-R0

The ATS-03A-32-C3-R0 is designed for use in a variety of applications and industries. It is commonly used in data centers, servers, supercomputers, signal processing, and industrial technologies. It is also a great choice for heat-intensive projects, such as gaming consoles, media playback devices, and other electrical and electronic components.

Working Principle of the ATS-03A-32-C3-R0

The ATS-03A-32-C3-R0 utilizes a combination of heat sink and fan systems to provide superior thermal management solutions. The heat sink absorbs heat from the processor or device and transfers it into the air. The fans then circulate the air, making sure that the heat is evenly dissipated. This process allows the device to operate at its optimal temperatures, while keeping noise levels to a minimum.

Conclusion

The ATS-03A-32-C3-R0 is an efficient and reliable thermal solution that combines the best of both worlds. Its combination of heat sink and fan systems allow it to provide superior thermal management solutions, while keeping noise levels to a minimum. This makes it an ideal thermal solution for most applications, and a great choice for those looking for an efficient and reliable heat management solution.

The specific data is subject to PDF, and the above content is for reference

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