ATS-03A-37-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-03A-37-C1-R0-ND

Manufacturer Part#:

ATS-03A-37-C1-R0

Price: $ 5.43
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X17.78MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03A-37-C1-R0 datasheetATS-03A-37-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.88124
30 +: $ 4.60992
50 +: $ 4.33881
100 +: $ 4.06766
250 +: $ 3.79648
500 +: $ 3.52531
1000 +: $ 3.45751
Stock 1000Can Ship Immediately
$ 5.43
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

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Thermal - Heat Sinks is a critical component of any electronic device, providing efficient cooling and protection against fluctuating temperatures. ATS-03A-37-C1-R0 is a particular model of heat sink that is designed to provide superior performance in a range of temperatures. This article will provide an overview of the application field and working principle of the ATS-03A-37-C1-R0.

Heat sinks are used in a variety of applications, ranging from cooling down critical components in electronic devices to providing a base on which to assemble other components. The ATS-03A-37-C1-R0 is designed specifically for cooling electronic components. It is designed to dissipate heat quickly, providing reliable cooling while reducing operating temperatures. This heat sink is also highly reliable and capable of providing superior cooling performance in a range of temperatures, from -20°C to 100°C.

The ATS-03A-37-C1-R0 is made of highly durable aluminum, which is capable of withstanding significant heat and corrosion. Its design features an ultra-thin profile to maximize heat dissipation, making it ideal for applications in tight spaces. It also features a unique “fins” design, which helps to dissipate heat more quickly and efficiently. The ATS-03A-37-C1-R0 is also designed with ventilation channels that promote heat transfer throughout the entire heat sink.

The working principle of this particular heat sink is based on the concept of forced convection. When forced convection is applied to a heat sink, air is moved through the fins of the heat sink in order to bring the cooling medium into contact with the hot surface. This air movement also serves to transfer the heat away from the critical components, dissipating it into the atmosphere.

The heat sink’s unique design also helps to maximize its cooling efficiency. The fins are designed to minimize the contact between the air and the heated components, while the design of the ventilation channels helps to promote cross-flow of air. This helps to increase the rate at which the heat is dissipated, improving the overall efficiency of the cooling system.

To ensure reliable operation of the ATS-03A-37-C1-R0 in a range of conditions, the heat sink is designed with a protective coating. This coating helps to reduce corrosion, as well as protecting the aluminum alloy from oxidation. Additionally, the coating helps to increase the durability of the heat sink, ensuring it is capable of providing reliable cooling performance for extended periods of time.

In summary, the ATS-03A-37-C1-R0 is a uniquely designed heat sink that is designed to provide superior cooling performance in a range of temperatures. Its unique design features help to promote efficient heat dissipation, while the protective coating helps to increase its durability. This makes the ATS-03A-37-C1-R0 an ideal choice for many applications requiring efficient cooling, including electronic device cooling.

The specific data is subject to PDF, and the above content is for reference

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