ATS-03A-70-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.69°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks are electronic components designed to facilitate healthy functioning of the electronic devices by providing the necessary heat dissipation. They are built in the form of metal pieces and are fastened to the electronic element with thermal grease or thermal pad, depending on its functioning environment. The purpose of a heat sink is to absorb and spread the heat produced from an electronic device, known as a source of heat. Heat is absorbed through special fins that are fitted with metal series of plates or rods that are called "fins". The heat is then dissipated by means of finned heat sink that is mounted onto the electronic component.The ATS-03A-70-C1-R0 Heat Sink is manufactured with an extruded fin construction and powder coated metal surface for extreme environmental conditions. The uniform heat dissipation surface ensures better thermal conductivity and improved cooling efficiency. The heat sink\'s in-line contacts design allows quick and easy installation, and improved contact stability. Its metal series of plates or rods, called fins, allow for even heat distribution throughout the heat sink, hence improving its overall thermal performance. The ATS-03A-70-C1-R0 Heat Sink is suitable for a wide range of cooling applications, such as cooling of power supplies, DC/DC converters, laser diode modules, LED drivers, amplifiers, motors, GPUs, and FPGAs. It is also useful for medical equipments, defense systems and digital signal processing systems.In terms of its working principle, the ATS-03A-70-C1-R0 Heat Sink consists of a baseplate, which is typically made of Cu-alloy or aluminum, and several aluminum fins. When the device is coupled to a source of heat, such as an electronic element, heat is introduced to the Heat Sink. The baseplate acts as a heat spreader, distributing the heat over a larger area of the fins. The fins themselves then act as heat exchangers and dissipate the heat to the surrounding environment. To maximize its cooling effect, the ATS-03A-70-C1-R0 Heat Sink is designed in such a way that the fins are installed perpendicular to the axis of the source of heat. This configuration maximizes the thermal contact between the source of heat and the Heat Sink, thereby increasing the cooling effect. The use of thermal grease or thermal pad is also critical in ensuring the overall performance of the ATS-03A-70-C1-R0 Heat Sink. The thermal grease works as a heat transfer agent, facilitating heat transfer from the source of heat to the heat sink. Thermal pad, on the other hand, is a sheet of insulation material that is applied to both the source of heat and the heat sink to reduce air gaps between the two surfaces.Another important aspect of the ATS-03A-70-C1-R0 Heat Sink is its mounting hardware. The overall performance of the Heat Sink is greatly impacted by the quality and type of mounting hardware used. It is important to ensure that the mounting hardware is strong and durable enough to support the weight of the Heat Sink. Additionally, the mounting hardware should also be applied evenly to maintain a good thermal connection between the Heat Sink and the source of heat.In conclusion, the ATS-03A-70-C1-R0 Heat Sink is an important tool that helps facilitate electronic device cooling capabilities. As such, the use of thermal grease or thermal pad, in combination with the heat sink\'s design, helps ensure improved thermal performance. Also, the use of high-quality mounting hardware is important in ensuring the proper and secure installation of the Heat Sink. With these considerations, the ATS-03A-70-C1-R0 Heat Sink is an effective and reliable way to cool electronic devices, even in extreme environmental conditions.

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