| Allicdata Part #: | ATS-03A-90-C3-R0-ND |
| Manufacturer Part#: |
ATS-03A-90-C3-R0 |
| Price: | $ 4.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03A-90-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.95577 |
| 30 +: | $ 3.73611 |
| 50 +: | $ 3.51628 |
| 100 +: | $ 3.29654 |
| 250 +: | $ 3.07677 |
| 500 +: | $ 2.85700 |
| 1000 +: | $ 2.80206 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
A heat sink is an essential component in any electronic system, as it helps to dissipate thermal energy produced by the components. High-performance electronics components are designed to operate within certain temperature ranges, so it is important to have an efficient heat dissipation system. The ATS-03A-90-C3-R0 Heat Sink is a versatile, high-performance product that is suitable for a wide variety of applications.
The ATS-03A-90-C3-R0 is made of extruded aluminum, which provides excellent conductivity and durability while remaining light-weight. The design consists of ribs and angled fins, which helps to increase the surface area of the heat sink and provide a better rate of heat transfer. The heat sink is designed to effectively dissipate heat generated by a variety of electronic components when mounted correctly. The ATS-03A-90-C3-R0 is also designed to be easy to install, as it features an all-in-one design that allows it to be mounted directly to the printed circuit board.
The ATS-03A-90-C3-R0 is designed to be versatile, allowing it to be used for a wide range of applications. The heat sink is commonly used in electronic components with high thermal output, such as CPUs, GPUs, and other high-powered devices. It is also suitable for use in automotive and aerospace applications, as well as in applications where heat dissipation is critical. The heat sink is effective at dissipating heat generated up to 150 watts.
The ATS-03A-90-C3-R0 heat sink operates on the principle of forced convection. The device has an inbuilt fan, which is powered by the system\'s power supply. As the fan runs, it creates airflow across the surface of the heat sink, which helps to swiftly remove the heat produced by the components. As the hot air is released from the fan, cooler air is drawn in, which helps to reduce the temperature of the electronics components.
The ATS-03A-90-C3-R0 is a high-performance heat sink that offers excellent efficiency and reliability. Its all-in-one design and versatile applications make it an ideal choice for a wide range of applications where thermal management is essential. The heat sink\'s high-quality construction and efficient cooling technology ensures that it can effectively handle high thermal output without compromising the performance of the component.
The specific data is subject to PDF, and the above content is for reference