ATS-03A-97-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS6004-ND

Manufacturer Part#:

ATS-03A-97-C2-R0

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03A-97-C2-R0 datasheetATS-03A-97-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.93750
10 +: $ 3.82851
25 +: $ 3.61595
50 +: $ 3.40326
100 +: $ 3.19051
250 +: $ 2.97781
500 +: $ 2.76511
1000 +: $ 2.71193
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 20.30°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks Heat sinks are devices whose purpose is to dissipate heat from a given source. ATS-03A-97-C2-R0 is a heat sink device used primarily in cooling applications. This device is composed of a metal alloy or base material such as aluminum or copper. This base material is then cut and shaped into a heat sink cup-shaped component that fits within a larger container. If water is circulated through the container, then the heat sink is able to absorb the heat from the source and cool it down before the heated water is discharged out of the device.The basic principle behind how the ATS-03A-97-C2-R0 works is based on the thermodynamic property of specific heat capacity. Specifically, when two different objects are at different temperatures, heat will flow from the higher temperature object to the lower temperature object. In this device, the heat generated by the source is distributed over the entire surface of the heat sink, which is then cooled down in an efficient manner.One of the primary applications for the ATS-03A-97-C2-R0 is in cooling electronic components. As electronic components generate considerable amounts of heat when in use, it is important to have a heat sink device to effectively dissipate the heat away from the components. This device is typically used in conjunction with a water cooling system which circulates the heated water away from the parts. This helps to ensure that the parts do not overheat and, ultimately, fail prematurely.In addition to cooling electronic components, the ATS-03A-97-C2-R0 can also be used to dissipate heat away from a source machine. For example, it can be used to keep the core of a machine such as a server, computer or industrial machinery cool. This is done by using a fan or blower to force air over the heat sink and away from the source.Finally, the ATS-03A-97-C2-R0 can also be used in industrial applications. In this case, the heat generated by industrial processes can be dissipated out of a machine by passing the heated air through the heat sink. This helps to prevent the machine from overheating and will often improve the efficiency and throughput of a process.Overall, the ATS-03A-97-C2-R0 is a versatile heat sink device. Its main purpose is to dissipate heat away from a given source and, in doing so, improve the efficiency and performance of the system. It can be used in a wide range of applications such as cooling electronic components, dissipating heat from a source machine and dissipating heat from industrial machinery. By using the basic principles of thermodynamics and heat transfer, the ATS-03A-97-C2-R0 can help to improve the efficiency and performance of many different types of machines.

The specific data is subject to PDF, and the above content is for reference

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