ATS-03B-10-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-03B-10-C1-R0 thermal-heat sinks are widely used in a range of applications. The main purpose of these thermal-heat sinks is to dissipate heat generated by the electronic components to which they are connected. They are particularly effective for cooling components at high temperatures. The thermal-heat sinks employ a heat transfer principle that exploits the difference in thermal properties between different materials and the interaction between the thermal interface material and the heat transfer material.

One of the biggest advantages of thermal-heat sinks is their ability to be customized to a particular application. For example, different sizes, shapes, and materials can be used to customize the thermal-heat sinks for a specific application. This allows the user to optimize the efficiency and performance of the thermal-heat sinks.

The ATS-03B-10-C1-R0 thermal-heat sink is designed to provide maximum heat transfer efficiency. It uses a combination of solid copper and aluminum for its thermal-heat sink fins and base. The solid copper helps to increase the overall heat transfer capacity while the aluminum helps to reduce the temperature of the components. The fins and base of the thermal-heat sink are designed to maximize air flow, allowing for efficient cooling of the component.

The thermal-heat sink also features a built-in thermal interface material (TIM) that helps to efficiently transfer heat away from the component. The TIM consists of an air gap between the component and the thermal-heat sink. This ensures that any heat that is generated is efficiently transferred away from the component. The TIM also helps to prevent the component from overheating.

The ATS-03B-10-C1-R0 thermal-heat sink also uses an innovative cooling system. It uses two separate fans mounted on the fins of the thermal-heat sink. The fans are actively regulated by a dedicated heat sink control system (HSCS). This system monitors the temperature of the component and adjusts the fan speed accordingly to ensure optimal cooling performance.

In addition to the cooling system, the ATS-03B-10-C1-R0 thermal-heat sink also features several other design features. For example, the thermal fins of the thermal-heat sink are slotted to provide maximum surface area. This helps to increase the heat transfer rate between the component and the thermal-heat sink. In addition, the thermal fins are equipped with fins shutters, which help to control the air flow over the thermal fins and minimize noise.

The ATS-03B-10-C1-R0 thermal-heat sink is ideally suited for a range of applications. It is particularly effective at cooling components that generate a large amount of heat, such as CPUs, GPUs, and other high-end components. This makes the ATS-03B-10-C1-R0 thermal-heat sink a popular choice for high-performance computing applications. In addition, the ATS-03B-10-C1-R0 thermal-heat sink can be used in a wide range of industrial and commercial applications where cooling high-performance components is necessary.

The ATS-03B-10-C1-R0 thermal-heat sink is an effective and reliable way of cooling components at high temperatures. Its design allows for efficient heat transfer from the component to the air and helps to prevent the component from overheating. The combination of the aluminum and copper heat transfer material, combined with the active fan cooling system, allows this thermal-heat sink to provide reliable cooling performance in a wide range of applications.

The specific data is subject to PDF, and the above content is for reference