| Allicdata Part #: | ATS-03B-100-C1-R0-ND |
| Manufacturer Part#: |
ATS-03B-100-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03B-100-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A heat sink is an electronic device that is used to dissipate heat away from electronic components. The ATS-03B-100-C1-R0 heat sink is a low-cost, high-power thermal management solution for controlling temperature rises in power electronic circuits. It is widely used in applications where power consumption and thermal regulation are of critical importance.
FUNCTIONALITY
The ATS-03B-100-C1-R0 heat sink has a variety of features that make it an ideal choice for devices requiring heat dissipation. Its aluminum fins are designed to ensure efficient heat transfer, providing secure attachment points for the heat sink to any surface and fastening screws to securely attach to the circuit board. The fin profile is optimized to increase the surface area and enhance heat dissipation. The heat sink is also coated with a black anodized epoxy, which offers thermal and electrical insulation.
APPLICATIONS OF ATS-03B-100-C1-R0 HEAT SINK
The ATS-03B-100-C1-R0 heat sink is used in applications that require efficient heat dissipation. It is suitable for power electronics design and can also be used in the automotive, military, and aerospace industries. It can be used to control the temperature rise of devices such as power transistors, MOSFETs, diodes, rectifiers, and switching circuits. The ATS-03B-100-C1-R0 heat sink is also used for cooling high-power LED devices, such as those used in lighting applications.
WORKING PRINCIPLE OF ATS-03B-100-C1-R0 HEAT SINK
The ATS-03B-100-C1-R0 heat sink operates using a passive thermal management design, which dissipates heat from the device to the environment. Heat is transferred from the heat-generating components to the heat sink fins, which are designed to increase the surface area and maximize heat dissipation. The heat is then dissipated into the ambient air through convection. The heat sink also uses the fans or coolers which enhance the heat dissipation process.
CONCLUSION
The ATS-03B-100-C1-R0 heat sink is an efficient and cost-effective solution for controlling temperature rises in power electronic circuits. It can be used in a variety of applications, including automotive, military, aerospace, and power electronics design. Furthermore, its passive design makes it easy to install and maintain. It is the ideal choice for devices requiring efficient thermal management and heat dissipation.
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