ATS-03B-113-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS6031-ND

Manufacturer Part#:

ATS-03B-113-C2-R0

Price: $ 3.52
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03B-113-C2-R0 datasheetATS-03B-113-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.20040
10 +: $ 3.11472
25 +: $ 3.03055
50 +: $ 2.86209
100 +: $ 2.69375
250 +: $ 2.52542
500 +: $ 2.44124
1000 +: $ 2.18870
Stock 1000Can Ship Immediately
$ 3.52
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.79°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are commonly used for cooling systems in a variety of industries as a cost-effective way of dissipating thermal energy in areas where small, compact solutions are needed. The ATS-03B-113-C2-R0 heat sink is one such device, and its application is one of the most important and common types of cooling system solutions. Its working principle is as simple as its design, and the device offers excellent efficiency for its application.

What is ATS-03B-113-C2-R0 Heat Sink?

The ATS-03B-113-C2-R0 is a heat sink module designed specifically for cooling systems within confined spaces. It is uniquely designed to dissipate heat from small, tight areas such as computers or other devices with tight clearances. The ATS-03B-113-C2-R0 heat sink is designed with a special shape and material composition that allows it to easily transfer the heat into the ambient air, resulting in improved heat dissipating capability. Additionally, the module has two sides for increased thermal performance.

What are the Applications of ATS-03B-113-C2-R0 Heat Sink?

The ATS-03B-113-C2-R0 module is quite versatile and is suitable for a variety of applications in many industries. It is used extensively in the computer industry for improving thermal efficiency and ensuring system stability. For example, the ATS-03B-113-C2-R0 heat sink is used in computers and servers to reduce CPU temperatures and improve their performance.

The ATS-03B-113-C2-R0 heat sink is also used in mobile phones, laptops, and game consoles for efficient cooling. As CPUs are often placed in tight spaces, it is important to provide efficient cooling, and the ATS-03B-113-C2-R0 heat sink is an ideal solution for such applications. The ATS-03B-113-C2-R0 heat sink is also used in the automotive industry in electric and fuel cell vehicles, as well as in industrial automation applications.

Working Principle of ATS-03B-113-C2-R0 Heat Sink

The ATS-03B-113-C2-R0 heat sink works by transferring the heat from the heat source to the ambient air, allowing for improved thermal performance. It operates using four principles, which include conduction, convection, radiation, and thermal interface.

The conduction principle works whereby energy in the form of heat is transferred from the heat source to the surrounding air. Heat is transferred from the heatsink to the ambient air by a process known as convection, where warmer air rises and cooler air falls, transferring the heat away from the heatsink. Radiation helps to dissipate the heat from the heatsink as well, while the thermal interface helps to ensure an effective connection between the heat source and the heatsink.

In conclusion, the ATS-03B-113-C2-R0 is a highly efficient and reliable module for cooling that provides an excellent solution for many industries. It is suitable for use in tight spaces and operates using the four principles of conduction, convection, radiation, and thermal interface.

The specific data is subject to PDF, and the above content is for reference

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