ATS-03B-123-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-03B-123-C3-R0-ND

Manufacturer Part#:

ATS-03B-123-C3-R0

Price: $ 3.86
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X20MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03B-123-C3-R0 datasheetATS-03B-123-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.50469
30 +: $ 3.31002
50 +: $ 3.11535
100 +: $ 2.92062
250 +: $ 2.72591
500 +: $ 2.53120
1000 +: $ 2.48253
Stock 1000Can Ship Immediately
$ 3.86
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.24°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

The ATS-03B-123-C3-R0 is a thermal-heat sink designed to help dissipate heat away from sensitive components. This device is designed for use in a variety of applications, such as electronics, telecommunications, automotive, medical, and more. This article will discuss the application field and working principle of the ATS-03B-123-C3-R0.

Application Field

The ATS-03B-123-C3-R0 is designed for use in a variety of applications where heat dissipation is important to reduce the risk of component damage or failure. It is especially useful for electronic devices, as they often generate considerable heat during operation. The ATS-03B-123-C3-R0 is also suitable for use in telecommunications, automotive, and medical applications, where high temperatures can be a major concern.

Working Principle

The ATS-03B-123-C3-R0 operates on the principle of conduction. When the device is in operation, heat from the source is conducted through the thermal-heat sink into the surrounding environment. The heat sink is composed of a series of thin metal fins, which help to increase the surface area over which heat can be dissipated. The fins are placed close together, and this ensures maximum heat dissipation. The air flow around the fins also helps to dissipate heat, as hot air rises and the cooler air passes through the fins and cools them down. This process helps to keep the internal temperature of the device under control and ensures that the surrounding environment does not become dangerously hot. The ATS-03B-123-C3-R0 is also designed with a heat sink cap, which helps to prevent any foreign matter, such as dust, from entering the fins and reducing their effectiveness. The cap also helps to reduce noise, as it prevents air from entering or leaving the device too quickly. This helps to ensure that the device operates silently and does not produce unwanted noise.

Conclusion

The ATS-03B-123-C3-R0 is an efficient thermal-heat sink designed to help dissipate heat away from sensitive components in a variety of applications. Through its conduction principle, the device uses a combination of fins and air flow to dissipate heat and keep temperatures at an acceptable level. The device is also designed with a heat sink cap, which prevents dust from entering the fins and reducing their efficiency while also keeping noise levels to a minimum. All of these features make the ATS-03B-123-C3-R0 an ideal choice for a variety of applications where heat management is necessary.

The specific data is subject to PDF, and the above content is for reference

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