| Allicdata Part #: | ATS6089-ND |
| Manufacturer Part#: |
ATS-03B-166-C2-R0 |
| Price: | $ 3.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03B-166-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.08700 |
| 10 +: | $ 3.00762 |
| 25 +: | $ 2.92648 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are popular solutions to the problem of dissipating heat quickly and efficiently from complex components used in a variety of electronics. A proper heat sink should match the characteristics of the device in order to dissipate the heat it produces throughout its surface area. The ATS-03B-166-C2-R0 heat sink offers varying characteristics depending on its application.
The ATS-03B-166-C2-R0 heat sink is a copper base plate with integrated thermally conductive aluminum fins. It works with the natural heat transfer property of conduction to filter heat away from the device. It can dissipate heat at extremely high levels, making it well-suited for applications involving high-powered components. The fin structure allows air molecules to pressurize against each other, allowing for greater air flow and therefore greater cooling performance.
The ATS-03B-166-C2-R0 heat sink is an effective solution for cooling high-powered components such as CPU, GPU, and memory modules. In computers, all components produce heat and need to be kept cool in order to ensure optimal performance. Heat sinks such as the ATS-03B-166-C2-R0 are designed to dissipate the heat generated by these components away from them, reducing the need for additional cooling systems.
The ATS-03B-166-C2-R0 heat sink not only provides effective cooling solutions but also helps improve system longevity. By removing the excess heat away from the components, the risk of burning them out is reduced significantly. Central Processing Unit and other heavily used components inside a computer are liable to overheat due to the high-powered processing and the excessive amount of heat it generates. A good thermal solution like the ATS-03B-166-C2-R0 can help reduce the chances of this happening significantly.
The ATS-03B-166-C2-R0 heat sink is an all-in-one solution for cooling high-powered components. Its aluminum and copper fin design along with its integrated thermally conductive base plate provide excellent performance on any application. Its minimal size and weight make it ideal for smaller applications such as cooling laptops, gaming consoles and other space-constrained devices. With its efficient cooling properties and ease of installation, the ATS-03B-166-C2-R0 is an excellent choice for any thermal needs.
The specific data is subject to PDF, and the above content is for reference