
Allicdata Part #: | ATS6108-ND |
Manufacturer Part#: |
ATS-03B-183-C2-R0 |
Price: | $ 4.32 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X20MM R-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.92490 |
10 +: | $ 3.81717 |
25 +: | $ 3.60511 |
50 +: | $ 3.39293 |
100 +: | $ 3.18087 |
250 +: | $ 2.96881 |
500 +: | $ 2.75675 |
1000 +: | $ 2.70374 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 5.37°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are commonly used as a type of thermal management system which allows for the safe and effective dissipation of heat due to electrical components. Generally, heat sinks are designed to use air to naturally dissipate the generated heat by pulling the heat away from its source and transferring it over a larger surface area. This allows for a higher rate of heat loss and can provide some cooling to the associated components. While they often employ passive cooling, active cooling methods can also be used for certain high powered components. One example of a heat sink is the ATS-03B-183-C2-R0.
The ATS-03B-183-C2-R0 is a liquid-cooled, extended self-cooled heat sink specifically designed to serve as a higher power cooling solution. It comes equipped with a water jacket that allows it to dissipate heat more efficiently by transferring higher amounts of thermal energy than air-cooled heat sinks. This allows it to support higher zero power dissipations and higher input power levels than air-based alternatives. The ATS-03B-183-C2-R0 also features an optimized fin pattern which allows for improved transfer of heat away from its source to its surroundings. This is achieved by creating a larger total surface area, which is much more efficient at dissipating the heat from the component.
The ATS-03B-183-C2-R0 is extremely versatile and can be used in a variety of application fields. For example, it can be found in consumer electronics such as cell phones, computers, and other equipment that must generate and maintain relatively high heat. It is also often used in military and commercial applications, as its durable construction and high thermal capabilities make it well-suited for the rigors of higher output demands. Additionally, it can be found in industrial applications such as LED lighting, automated manufacturing, and other process-intensive applications.
The ATS-03B-183-C2-R0 works by transferring the heat from its source to its surroundings. Firstly, the fin pattern of the heat sink created a large surface area which greatly increases the amount of heat loss. The water jacket then serves to draw the heat away from its source using a liquid coolant. This is dissipated even further by drawing more heat away from the component, thus allowing for a higher rate of heat transfer.
In summary, the ATS-03B-183-C2-R0 heat sink is a powerful cooling solution that features an optimized fin pattern and a liquid coolant for efficient transfer of heat. It is designed to be extremely versatile, featuring applications in consumer electronics, military and commercial equipment, and industrial processes. Its total surface area and liquid coolant effectively allow for a higher rate of heat loss, while its construction allows for a higher input power level and zero power dissipation. It is without a doubt a great thermal management system which provides a reliable and efficient way to dissipate excess heat.
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