ATS-03B-197-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-03B-197-C3-R0-ND

Manufacturer Part#:

ATS-03B-197-C3-R0

Price: $ 3.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03B-197-C3-R0 datasheetATS-03B-197-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.18591
30 +: $ 3.09981
50 +: $ 2.92774
100 +: $ 2.75549
250 +: $ 2.58325
500 +: $ 2.49714
1000 +: $ 2.23882
Stock 1000Can Ship Immediately
$ 3.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.05°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is the controlling of temperature or level of heat dissipation in order to increase the efficiency of a device or system. Heat sinks are one of the most important components to achieve effective thermal management. Heat sinks are designed to dissipate heat away from components so that the ambient temperature remains optimized for proper operation. ATS-03B-197-C3-R0 is a thermal heat sink that is specifically designed to improve the thermal management process. The purpose of this article is to discuss the application field and working principle of ATS-03B-197-C3-R0.

ATS-03B-197-C3-R0 is an aluminum finned heatsink with a reliable external heat source. The design of this heat sink utilizes forced convection cooling, with the external heat source pushing air over the fins in order to dissipate the heat. It is most suitable for use in high power density applications such as telecom base stations, servers, and embedded systems. The ATS-03B-197-C3-R0 design also offers a cost-effective solution, with optimal performance and reliable operation in industries where low-noise operation and minimal space for air flow is necessary.

The ATS-03B-197-C3-R0 works by allowing air to pass through its array of aluminum fins, which help to increase the surface area available for heat dissipation. Heat is dissipated through the heat sink fins, which act as conductors that extract heat from the component and move it away from the component and into the surrounding environment. The ATS-03B-197-C3-R0 features a “4-in-1” design that supports four IP68 seals, allowing for better management of any water or dust exposure. Additionally, the heat sink is designed to support an external fan, providing added support for larger applications that require higher air flow and improved cooling performance.

The ATS-03B-197-C3-R0 can also be fitted with a fan cover to improve airflow and decrease noise levels. The installation of the fan cover also helps to protect the fan from dust, dirt, and debris. Additionally, the heat sink is constructed with self-clinching studs to ensure the secure installation of the ATS-03B-197-C3-R0 to the device. Furthermore, the integrated anti-vibration rubber washers reduce the vibrations caused by the heat sink, further improving the noise level.

In conclusion, the ATS-03B-197-C3-R0 is a highly efficient thermal heat sink designed to provide a cost-effective, efficient, reliable, and low-noise solution. It is a reliable solution for stable thermal performance and is suitable for use in a wide variety of applications, including telecom base stations, embedded systems, and servers. The ATS-03B-197-C3-R0 utilizes forced convection cooling and integrates a “4-in-1” design for superior protection. Furthermore, it can also be fitted with a fan cover to improve airflow and reduce noise levels, enabling more efficient and stable performance.

The specific data is subject to PDF, and the above content is for reference

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