| Allicdata Part #: | ATS-03B-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-03B-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-03B-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are a vital component for a wide range of electronic devices. These devices require effective and reliable thermal management system to ensure that they do not overheat and remain at an optimal operating temperature. ATS-03B-20-C1-R0 is a high performance heat sink designed to meet the exacting requirements of the modern electronic device and incorporates a number of advanced features for better performance. The ATS-03B-20-C1-R0 is designed to fit into tight spaces, making it an ideal solution for many applications.
The working principle of the ATS-03B-20-C1-R0 is based on the heat conduction process. This process involves passing heat energy from the device to the heat sink, which dissipates the energy through its fins. To ensure effective heat transfer, ATS-03B-20-C1-R0 heat sinks use a high performance thermal conductivity compound, which maximizes the efficiency of heat transfer. The surface of the heat sink is also coated with a special heat-dissipating material, which further improves the performance and thermal stability of the heat sink.
The ATS-03B-20-C1-R0 is suitable for a variety of applications, such as LED lighting modules, data storage systems, and optical components. It is designed to be a general-purpose low profiled heat sink and can be used in various applications, ranging from low power computer systems to high performance consumer electronics. It is also a great choice for server applications where space is at a premium.
The ATS-03B-20-C1-R0 features a high-performance design, which helps it to efficiently cool down components under high temperatures. It is lightweight but durable, and withstands the extremes of temperature and air flow. The design also incorporates a number of other features that increase efficiency and reduce wear and tear. The heat sink is designed for easy installation and is suitable for most mounting configurations, making it an ideal choice for a wide range of applications.
The ATS-03B-20-C1-R0 is a versatile and reliable heat sink with many features that make it a great choice for many applications. Its high performance design helps dissipate the heat quickly and efficiently, while its low profile design saves precious space. The heat sink is also easy to install and can withstand extreme temperatures and airflows. It is an ideal choice for a wide range of applications, such as LED lighting modules, data storage systems, and optical components.
The specific data is subject to PDF, and the above content is for reference
ATS-03B-20-C1-R0 Datasheet/PDF