| Allicdata Part #: | ATS-03B-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-03B-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03B-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are found in many electronic components, such as processors, audio chips, and circuit boards. They are used to dissipate excess heat generated by the components. The ATS-03B-20-C3-R0 heat sink is a powerful and reliable thermal solution for dissipating large amounts of heat. It is designed to provide superior cooling efficiency for applications in telecommunications, computers, military, medical, and aerospace industries.
The ATS-03B-20-C3-R0 heat sink has an aluminum fin construction that offers excellent thermal performance and allows for quick heat dissipation. It is designed with a 2-Fin and 3-Pin arrangement that enables air to flow around the fins for efficient cooling. The fins are spaced apart to provide better air circulation for maximum cooling. The aluminum fins are stamped with a high-grade thermal conductivity to increase heat dissipation. The heat sink’s mounting system is compatible with most standard motherboards and processors.
The ATS-03B-20-C3-R0 heat sink has a working principle based on convection. As heat is generated by the component, it moves through the fins, dissipating heat into theair. The fins act as radiators to disperse the heat quickly and evenly. The convective heat transfer helps to cool the components quickly and efficiently. The temperature is regulated by the air flow around the fins, and the fins are designed to increase the air flow and reduce the heat.
The ATS-03B-20-C3-R0 heat sink is designed to meet the needs of the telecom, computer, military, medical, and aerospace industries. It is a reliable and cost-effective thermal solution for applications that require large amounts of heat to be dissipated quickly. The fanless design ensures long-term dependability, and the aluminum fins provide maximum cooling efficiency. The ATS-03B-20-C3-R0 heat sink is a reliable and efficient thermal solution that is sure to provide excellent performance in demanding applications.
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