| Allicdata Part #: | ATS6130-ND |
| Manufacturer Part#: |
ATS-03B-203-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03B-203-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are commonly used in many different applications and are used to reduce or transfer heat away from sensitive components in order to protect them from overheating. The ATS-312-203-C2-R0 thermal-heat sink is a relatively new type of heat sink that is designed to provide efficient cooling and heat dissipation for electronic components.The ATS-312-203-C2-R0 heat sink is composed of a series of thin aluminum fins which attach, or "stack" on the base as a modular structure. The thermal-heat sink creates convection within its structure, allowing increased airflow. The fins of the thermal-heat sink are designed to expand and contract as needed, allowing the fin size to be adjusted without the need to drill and tap the base. The heat sink has an efficient and reliable thermal dissipation capacity, thanks to a thick base plate which transfers heat quickly and efficiently.
The ATS-312-203-C2-R0 heat sink has a clever design which allows it to be used in both vertical and horizontal orientations. It can also be easily attached to a chassis or circuit board with its easy attachment system. The thermal heat sink is designed to improve both the thermal management and airflow of its components. Furthermore, the ATS-312-203-C2-R0 heat sink has an impressive ability to draw heat away from components at a greater rate than traditional heatsinks, thanks to its efficient design.
The ATS-312-203-C2-R0 heat sink is designed to provide protection for components from overheating, while also helping to improve the performance and durability of the components. It is also built for low-noise operations, thanks to its low-profile design which reduces the noise from the fans associated with it. This is beneficial in various scenarios, such as when working in a studio or office environment.
The ATS-312-203-C2-R0 heat sink has a wide range of applications in various industries, such as gaming, multimedia, servers, industrial, and other consumer-oriented products. It is also compatible with various motherboards, and provides efficient and effective thermal management for a wide range of components. Furthermore, the ATS-312-203-C2-R0 heat sink can also be used in thermal management testing and development, as well as engineering experiments and research.
In conclusion, the ATS-312-203-C2-R0 thermal-heat sink is a revolutionary invention which can provide efficient cooling and thermal management for a wide range of components, including gaming, multimedia, and server systems. It is effective and reliable, thanks to its efficient design and easy attachment system. It can also be used in vertical and horizontal orientations, allowing users to choose the best position for their components. Overall, the ATS-312-203-C2-R0 heat sink is a great choice for anyone looking to provide efficient and effective thermal management for their components.
The specific data is subject to PDF, and the above content is for reference