| Allicdata Part #: | ATS-03B-210-C1-R0-ND |
| Manufacturer Part#: |
ATS-03B-210-C1-R0 |
| Price: | $ 5.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03B-210-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.78863 |
| 30 +: | $ 4.52256 |
| 50 +: | $ 4.25653 |
| 100 +: | $ 3.99055 |
| 250 +: | $ 3.72451 |
| 500 +: | $ 3.45848 |
| 1000 +: | $ 3.39196 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.17°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an increasingly important role in a wide range of industrial and commercial applications. Heat dissipation is a crucial consideration when designing high-performance electronic devices, such as high-power semiconductor chips and computer systems. ATS-03B-210-C1-R0 is a heat sink that can be used in any system that requires thermal management. In this article, we will discuss the application field and working principle of the ATS-03B-210-C1-R0 thermal-heat sink.
The ATS-03B-210-C1-R0 is designed to dissipate large amount of heat generated by low profile devices and other high-performance components. It can be used in a wide range of applications such as aerospace, automotive, industrial automation, and computer systems. Because of its small size, it is ideal for compact systems where space is a premium. This type of heat sink is designed to efficiently transfer heat away from the device into the ambient environment.
The ATS-03B-210-C1-R0 is constructed from a corrosion resistant aluminum alloy, which provides great thermal conductivity. The heat sink is also designed with a set of thermal conduits, which allow the heat to be more efficiently transferred into the ambient environment. The fins of the heat sink help to dissipate the heat faster by increasing the surface area. To ensure the maximum efficiency of heat transfer, the heat sink is installed with thermal compound or thermal tape.
In addition to the aluminum alloy, the ATS-03B-210-C1-R0 also features a smooth surface finish to promote efficient heat transfer. The fins of the heat sink are arranged in a concentric pattern for optimal air flow. This promotes the cooling of the device due to convection air currents, allowing the heat sink to effectively absorb and dissipate heat away from the system. The heat sink also features a low-level noise design, which ensures that the fan operates at a lower frequency, reducing noise levels.
Overall, the ATS-03B-210-C1-R0 is a reliable and efficient thermal-heat sink that can be used in any system that requires thermal management. Its high-efficiency design not only ensures that the device runs cooler, but also runs quieter and with less power consumption. The heat sink is made from a corrosion resistant aluminum alloy, which provides excellent thermal conductivity and helps to transfer heat away from the device into the ambient environment. It also features a smooth surface finish for improved heat transfer, and its fins are arranged in a concentric pattern for optimal air flow. With all these features, the ATS-03B-210-C1-R0 is an ideal thermal-heat sink for any application that needs to keep the device cool and quiet.
The specific data is subject to PDF, and the above content is for reference