| Allicdata Part #: | ATS-03B-38-C3-R0-ND |
| Manufacturer Part#: |
ATS-03B-38-C3-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03B-38-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat Sinks are widely used in the modern world, from providing heat emitting support in technology and industry to cooling down high-powered electronics in the home. they are generally installed in electronics with high power consumption and require a cooling system. An example of such a device is the ATS - 03B - 38 - C3 - R0 thermal-heat sink, a versatile device used to both dissipate heat as well as cool down surrounding components.
The ATS-03B-38-C3-R0 thermal-heat sink is specifically designed for use in applications that require high performance thermal-heat dissipation and cooling. Essentially, the device works to pull heat away from heat emitting components and dissipate it evenly, allowing the components to maintain their optimal temperatures. An important application for the device is in the cooling of high power components within all types of electronics, from televisions and computers to gaming consoles and electronics within vehicles.
The ATS-03B-38-C3-R0 thermal-heat sink\'s performance is derived from its design structure, which is based on a single heat dissipation machine and a finned aluminum heat spreader. The heat dissipation machine, which is the fan, utilizes appropriate airflow to cool down nearby components, forcing the hot air out. The spreader, on the other hand, absorbs the heat from the nearby components and transfers it to the fins, where it is dissipated into the surrounding environment. These two components work together to pull heat away from the components and dissipate it into the surrounding environment.
When it comes to installation, the ATS-03B-38-C3-R0 is simple and straightforward. The device attaches directly to the mainboard of the device, typically under the CPU, where it can draw in the most amount of heat. The device also utilizes a snap-on mounting bracket to securely fasten the device to the mainboard. This helps to increase the heat spreader\'s contact area and ensures that the fan is securely installed.
Overall, the ATS-03B-38-C3-R0 thermal-heat sink is an effective device for thermal and heat dissipation. It provides an efficient way to dissipate heat away from high power consuming components while also cooling down nearby components. The device\'s snap-on mounting bracket ensures secure installation and the two component design offers an efficient way to dissipate heat away from the device. This makes it an ideal choice for anyone looking to keep their high-powered electronics within their optimal temperatures range.
The specific data is subject to PDF, and the above content is for reference