ATS-03B-43-C1-R0 Fans, Thermal Management

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	28.78°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Thermal - Heat Sinks are devices designed to draw heat away from electronic components and dissipate it into the ambient air, thus preventing vital components from overheating. They are found in all types of electronic appliances, from high-end computers and servers to hand-held gaming systems and small electronics.The basic technology behind Thermal - Heat Sinks relies on thermodynamics and convection, not dissimilar to the cooling effect of a fan. Heat is trapped near the surface of the component and dispersed through the use of a finned heat sink or other cooling mechanism. Heat transfer occurs when cooler air from outside is drawn in and heated air from the component is expelled, allowing the component to stay cool and work at optimum efficiency.

ATS-03B-43-C1-R0 Application Field & Working Principle

The ATS-03B-43-C1-R0 Heat Sink is a device designed to draw heat away from temperature-sensitive components and dissipate it into the surrounding atmosphere. It is designed and manufactured by AMKOR Technology, and its main application fields include computer systems, industrial equipment, and other electronics.The ATS-03B-43-C1-R0 consists of a base plate, a metal heat sink, an adhesive tape, and a clip cover. The base plate is connected to the heat sink, which is attached to the component via the adhesive tape. Heat is dissipated by the simple principle of convection: cooler ambient air flows over the heat sink to absorb the heat generated by the component, while the heated air is expelled into the surrounding atmosphere. The metal heat sink is optimized to provide maximum surface area for efficient heat transfer.The ATS-03B-43-C1-R0 is optimized for maximum thermal performance with minimum space and weight, making it an ideal solution for a variety of applications, including medical and audio/video applications. Its small form-factor and low profile make it suitable for tight spaces, including mobile electronic devices.The ATS-03B-43-C1-R0 is designed to be durable and reliable, with a low thermal resistance of 0.082C°/W, providing reliable component cooling in high-temperature environments. It is also RoHS compliant and includes a robust clip cover to secure the heat sink in place.Overall, the ATS-03B-43-C1-R0 is suitable for a wide range of applications, making it an excellent thermal management solution for high-temperature environments. Its superior thermal performance, small form-factor, and low profile make it an ideal solution for various electronic devices.

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