ATS-03B-60-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.36°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction
Thermal - Heat Sinks are an important factor in industrial and consumer products. They help dissipate the generated heat in these applications, protecting them from damage and overheating. The ATS-03B-60-C2-R0 is a thermally-optimized aluminum core heat sink designed to dissipate the heat created by high-power processors, LED lighting, and other applications. With an aluminum core frame and a combination of features that lets users customize the design, the ATS-03B-60-C2-R0 is a great choice for PC, consumer, and industrial applications. Application Field
The ATS-03B-60-C2-R0 is a heat sink designed to dissipate the heat generated by high-power processors, LED lighting, and other applications. It can be used in high-performance PCs, as well as consumer and industrial applications. The thermally optimized aluminum core design of the ATS-03B-60-C2-R0 makes it an ideal choice for overclocking and other applications that require a lot of heat dissipation. It\'s also great for overclocking and other high-performance operations.Construction & Key Features
The ATS-03B-60-C2-R0 is constructed using an aluminum core frame and is designed with a combination of features that allow users to customize the design. The heat sink consists of a large fin array that increases the amount of air that passes through the fins, aiding in heat dissipation.The ATS-03B-60-C2-R0 also features integrated heat pipes to conduct heat away from the processor and into the fin array. This allows for more efficient cooling and more even temperatures throughout the system. Additionally, the ATS-03B-60-C2-R0 also has a fanless design that ensures silent operation and improved airflow. Advantages over competing technologies
The ATS-03B-60-C2-R0 has several advantages over competing technologies. The integrated heat pipes are more efficient at conducting heat away from the processor and into the fin array. Additionally, the fanless design ensures silent operation and improved airflow. Finally, the aluminum core frame and the fin array provide increased amounts of air passing through, providing improved cooling performance.Working principle
The ATS-03B-60-C2-R0 operates using the principle of convection. Heat is conducted away from the processor and into the fin array by way of the integrated heat pipes. The air passing through the fins is heated as it passes through, and the heat is dissipated into the surrounding environment. This allows for the system to stay cool and be more efficient. Conclusion
Thermal - Heat Sinks are an essential element in many industrial and consumer products. The ATS-03B-60-C2-R0 is an excellent thermally optimized aluminum core heat sink designed to dissipate the heat created by high-power processors, LED lighting, and other applications. With an aluminum core frame, a combination of features, and a fanless design, the ATS-03B-60-C2-R0 is great for overclocking and other high performance operations. It also offers improved efficiency and heat conduction and is an ideal choice for PCs, consumer, and industrial applications.

The specific data is subject to PDF, and the above content is for reference