| Allicdata Part #: | ATS-03B-70-C1-R0-ND |
| Manufacturer Part#: |
ATS-03B-70-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03B-70-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a vital part of any electronic product for optimizing performance and reliability. The ATS-03B-70-C1-R0 series of thermal heat sinks provide excellent performance and robustness for any application that requires thermal control. This extensive thermal heat sink series offers superior performance and cost-effectiveness for cooling sensitive electronics.
The ATS-03B-70-C1-R0 series is designed to provide superior cooling capabilities by dissipating heat from the device. The thermal heat sink utilizes an array of fins, designed for maximum area contact with the cool air, allowing for effective heat dissipation. Additionally, the optimized aluminum fins provide excellent electrical and heat transfer properties, ensuring efficient heat dissipation. The accuracy of the ATS-03B-70-C1-R0 series is second to none and ensures maximum cooling performance.
The heattransfer from a hot device to a cool environment is achieved by the thermal heat sink by utilizing a combination of natural convection and forced convection forces. Natural convection is created as the air passing through the fins of the heat sink absorbs the heat emitted from the device. Forced convection is accomplished by the use of fans attached to the heat sink, which increases the amount of air passing through the fins and the amount of heat being transferred away from the device.
The ATS-03B-70-C1-R0 series of thermal heat sinks is designed to accommodate a wide range of applications for controlling and maintaining the temperature of electronic components including CPUs, GPUs, FPGAs, video cards, storage devices, and other sensitive components. The array of fins are optimized for each application to ensure the best thermal performance while being as energy efficient as possible.
The ATS-03B-70-C1-R0 series of thermal heat sinks feature a ruggedized frame designed for ruggedized applications. This makes the heat sinks perfect for extreme environment applications and reduces installation time for server and industrial applications. The thermal heat sinks are also equipped with a protective coating that prevents oxidation and corrosion from exposure to harsh elements. This ensures a longer life span for the equipment even with heavy usage.
The ATS-03B-70-C1-R0 series is a great choice for any application requiring thermal management and protection. Its superior construction, optimized fins, and ruggedized frame ensure superior performance, durability, and cost-effectiveness for cooling sensitive electronics. With its versatile design and wide range of applications, the ATS-03B-70-C1-R0 series of thermal heat sinks offer excellent performance and cost-effectiveness for any application.
The specific data is subject to PDF, and the above content is for reference