ATS-03B-73-C1-R0 Fans, Thermal Management

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	28.78°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal management is the practice of controlling the temperature of electronic and electrical equipment to ensure safe and reliable operation. Heat sinks are passive cooling devices that use finned surfaces to dissipate heat away from a heat source. The ATS-03B-73-C1-R0 heat sink is a special heat transfer product designed for high-power devices operated in harsh environments. The device is specifically designed to eject thermal energy during operation to regulate the temperature inside an electrical system.The ATS-03B-73-C1-R0 features a metal alloy construction, which improves the device\'s ability to effectively transfer heat away from its base. The heat sink has a large thermal capacity and low thermal resistance. These characteristics ensure efficient heat transfer from the sink to its environment. The device also includes fins and a thermal pad that increase its ability to absorb and dissipate heat from a variety of sources.The ATS-03B-73-C1-R0 is designed for use in a wide range of applications. It is well-suited for direct attachment to high-power devices such as power supplies and DC-DC converters. The device is also suitable for thermal management in applications that require efficient cooling of sensitive components. Additionally, the device can be mounted on a circuit board or surface mount connector to support efficient temperature reduction in high-powered devices, such as in servers and power amplifiers.The ATS-03B-73-C1-R0’s working principle is relatively simple. When the device is subjected to a heat source, its base absorbs the energy and transfers it through the internal channels. The resulting thermal energy is then expelled into the surrounding environment by the fins. This helps to reduce the heat inside the electrical system and protect the device from damage due to overheating or thermal runaway. It is important to note that the device should be mounted correctly and securely to ensure optimal heat dissipation.The ATS-03B-73-C1-R0 is a highly effective heat transfer device and is ideal for a variety of applications. The device’s construction enables it to absorb and dissipate heat quickly and efficiently. The device’s large thermal capacity and low thermal resistance ensure that it can be relied upon for reliable cooling in extreme environments. Mounting the device correctly helps to maximize its effectiveness and ensures that it can reduce the temperature within an electrical system effectively and reliably.

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