ATS-03C-05-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.84°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-03C-05-C3-R0 Application Field and Working Principle

Thermal-heat sinks are important components in cooling electronic and electrical assemblies. Heat management is critical for the safe operation of all these devices and products. ATS-03C-05-C3-R0 is a thermal-heat sink developed and manufactured by Advanced Thermal Solutions, Inc. (ATS), which provides advanced cooling solutions for high performance electronics and electrical assemblies. This article provides an overview of the application field and working principle of ATS-03C-05-C3-R0.

Application Field of ATS-03C-05-C3-R0

ATS-03C-05-C3-R0 is a high-performance thermal-heat sink that can be used in a variety of different device, product, and assembly applications. It is designed for high-dissipation conditions, such as multiple component use or in harsh thermal and environmental conditions. This thermal-heat sink can be used in a variety of electronic applications, such as microprocessors, embedded systems, and desiccant systems. It is also suitable for use in medical, automotive, industrial, and military applications.

Working Principle of ATS-03C-05-C3-R0

ATS-03C-05-C3-R0 is based on a heat sink design. Heat sinks are devices that absorb and dissipate heat away from a solid object, typically a semiconductor device or circuit board. The working principle of ATS-03C-05-C3-R0 is based on the thermoelectric Peltier effect. The Peltier effect is the ability of a material to transfer heat from one side of the material to the other when electrical current is applied. ATS-03C-05-C3-R0 uses this effect to quickly absorb and dissipate heat. The cold side of the heat sink is made from a thermally conductive material, such as copper. The hot side is an aluminum block, which serves to absorb and dissipate heat away from the device or component. The aluminum block is then connected to a finned radiator by a series of heat pipes. The heat pipes serve to transfer heat quickly and efficiently from the aluminum block to the radiator. The finned radiator then dissipates the heat into the surrounding air. The finned radiator also serves as a thermal buffer between the device and the surrounding environment.

Conclusion

ATS-03C-05-C3-R0 is a high-performance thermal-heat sink designed and manufactured by Advanced Thermal Solutions, Inc. This thermal-heat sink can be used in a variety of electronic, medical, automotive, industrial, and military applications. It utilizes the thermoelectric Peltier effect to quickly absorb and dissipate heat away from the device or component. ATS-03C-05-C3-R0 also has a finned radiator to dissipate heat into the surrounding air and to provide thermal buffering between the device and its environment.

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