ATS-03C-06-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.15°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal management solutions are vital for protecting and increasing the lifespan of electronic components, making sure that the device does not overheat and becomes damaged. ATS-03C-06-C1-R0 is a heat sink-based cooling and thermal management solution. It is frequently found in computing systems, including servers, desktop PCs, and laptop computers, as well as industrial process controllers and robotics.

ATS-03C-06-C1-R0 Application Field

Most thermal management solutions are designed to dissipate thermal energy by using heat sinks. The ATS-03C-06-C1-R0 is a heat sink and fan combination that provides up to 63 watts of cooling power to help control the temperature within a system. It is suitable for applications that require both cooling and thermal protection, such as servers, computer systems, and industrial process controllers.The ATS-03C-06-C1-R0 is designed for use in computer, server, and industrial applications with processors that generate higher temperatures than their counterparts in smaller devices. It is capable of cooling a processor up to 100 watts and can be used in both forced air convection and liquid cooling systems. The heat sink measures 90 mm x 95 mm x 23 mm and weighs just 170 g.

ATS-03C-06-C1-R0 Working Principle

Heat sinks are essential components in thermal management solutions because they are designed to dissipate thermal energy away from electronic components, thus preventing damage and ensuring proper functioning. The ATS-03C-06-C1-R0 is a heat sink that is designed to dissipate thermal energy away from the processor by using a combination of thermal energy absorption and airflow. The ATS-03C-06-C1-R0 is designed to dissipate thermal energy by combining both conduction and convection. It has a number of fins, which act as conduction pathways that absorb thermal energy from the processor. This thermal energy is then transferred to an air-cooled aluminum heat sink, which acts as a larger surface area for convection to dissipate the thermal energy.The ATS-03C-06-C1-R0 also incorporates a fan into its design to further increase the airflow and ensure that the processor remains cool. This fan operates at variable speeds, depending on the temperature of the system and helps to keep the processor running efficiently and reliably.

Conclusion

The ATS-03C-06-C1-R0 is a heat sink-based cooling and thermal management solution that is designed for use in computers, servers, and industrial applications that require more cooling power. It is designed to dissipate thermal energy away from the processor by using a combination of thermal energy absorption and airflow provided by a fan. Its size, weight, and cooling capacity make it an ideal choice for applications that require more thermal protection.

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