ATS-03C-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-03C-10-C1-R0-ND

Manufacturer Part#:

ATS-03C-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03C-10-C1-R0 datasheetATS-03C-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-03C-10-C1-R0 thermal-heat sink is a versatile and efficient tool designed to help engineers in a wide variety of applications. It is a high-performance, high-speed, and temperature-controlled thermal device that is often used in medical, aerospace, and military fields. This thermal-heat sink can also be used to design, control, or cool a wide range of electronic circuits, components, and systems.

The ATS-03C-10-C1-R0 thermal-heat sink uses a special coating to absorb and dissipate heat from components and systems. The special coating is designed to wick away the heat quickly and efficiently. This allows for more accurate temperature control by minimizing thermal losses. The heat sinks also come with a host of features that improve its performance. It can be set to lower temperatures, enabled with various thermal management features, and is also equipped with a series of voltage regulators to increase system performance.

The ATS-03C-10-C1-R0 thermal-heat sink’s working principle can be summarized as follows. Heat accumulates in a component or system due to power dissipated into the environment. The thermal-heat sink uses a special thin coating to absorb and dissipate this heat, allowing for temperature control and increased performance. The heat transfer is also enhanced by the use of a conductor base plate or integrated plates and combined heat sinks.

The thermal-heat sink features a series of heat pipes embedded within its wall. These heat pipes are filled with a specially formulated fluid that is known to have excellent heat transfer characteristics. The heat pipes connect to a finned surface, creating a large area for heat transfer. As the temperature of the heat sink increases, the fluid in the heat pipe conduit warms, resulting in heat being conducted away from the component or system.

The ATS-03C-10-C1-R0 thermal-heat sink is also equipped with an array of thermal management features. It is designed with a two-stage efficiency rating that allows engineers to maintain both short- and long-term thermal efficiency. The heat sink also comes with integrated fan cooling options, an adjustable clamping mechanism, and a unique system control system.

The ATS-03C-10-C1-R0 thermal-heat sink is reliable, durable, and provides long-term thermal management. Additionally, it is cost-effective, easy to install and maintain, and has a wide range of applications. As such, it can be a beneficial tool for any engineer looking to make the most out of their projects or situations.

The specific data is subject to PDF, and the above content is for reference

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