| Allicdata Part #: | ATS-03C-112-C1-R1-ND |
| Manufacturer Part#: |
ATS-03C-112-C1-R1 |
| Price: | $ 5.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-03C-112-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.98519 |
| 30 +: | $ 4.70841 |
| 50 +: | $ 4.43142 |
| 100 +: | $ 4.15441 |
| 250 +: | $ 3.87745 |
| 500 +: | $ 3.60048 |
| 1000 +: | $ 3.53125 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
ATS-03C-112-C1-R1 is a thermal- heat sink application and is widely used in many different industries. The heat sink is made up of two components, a heat source and a thermal management component. Heat is generated when the heat source is subjected to a high temperature. The thermal management component then helps to dissipate the heat by radiating it away from the heat source.
In the case of ATS-03C-112-C1-R1, the heat source is a high-powered light source such as an LED light. The thermal management component utilizes a constructed aluminum alloyed material to act as an effective heat conductor and absorb the heat from the LEDs. As a result, the heat is dispersed before it can gain significant heat and cause damage.
The heat sink is used to maintain the temperature of the equipment it is installed on. This is accomplished by utilizing the heat sink’s ability to dissipate heat from the surface quickly. This leads to a lower overall temperature at the component’s constant heat generating source and therefore the component can operate efficiently without the risk of overheating.
The thermal- heat sink is also known to be highly efficient and reliable when it comes to thermal management. In general, it is a durable component and for this reason requires less frequent maintenance or replacement. The material used in its construction are also very cost effective, making it very inexpensive to purchase. This makes it a great choice for those who want a quality thermal management solution without spending too much money.
In conclusion, the ATS-03C-112-C1-R1 is an ideal thermal- heat sink for many applications. It is highly efficient, reliable and cost effective. It is easy to install and can prove to be an ideal solution for dissipating heat from electronic components, while still maintaining proper operating temperatures.
The specific data is subject to PDF, and the above content is for reference
ATS-03C-112-C1-R1 Datasheet/PDF