ATS-03C-117-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Temperature plays an important role in the stability and reliability of any piece of technology. On those occasions when a device becomes too hot, thermal management measures need to be taken to regulate heat production and transfer. One such measure is the use of heat sinks, which transfer the heat from the source and dissipate it into the surrounding environment. The ATS-03C-117-C1-R0 is a type of heat sink designed to do just that. This heat sink is a combination of a plate fin housing and a mounting bracket with an end closure designed to provide a more efficient heat transfer path. This enables the device to keep operating at an optimal temperature, while also providing increased air circulation. The heat sink is composed of a high thermal conductivity material, usually aluminum or copper, which makes it well-suited for use in electronic application fields such as PC boards. The ATS-03C-117-C1-R0 has a standard 0.375 inch tab width and height of 0.687 inches. To ensure maximum heat conductivity, it has been designed with a series of openings in the heat fins, which increase the surface area available for the transfer of heat. The size and number of openings are determined according to the expected power dissipation and cooling needs of the device it is being used with. The size of the fin also varies depending on the application, as it can be either standard or increased fin size. The unit also has an impedance of 8.7 ohm, which further assists in effective heat transfer.The working principle behind the ATS-03C-117-C1-R0 is simple. The heat from the device is transferred via conduction to the metal of the heat sink which then disperses it into the surrounding air, so long as the air has sufficient circulation. This is done by taking advantage of the thermal conductivity of the heat sink material and the agreement between the two parts. The greater the difference between the two, the more effective the process will be.The ATS-03C-117-C1-R0 is a highly effective heat sink for protecting delicate electronic components and reducing the temperature of operating environments. It is used in a variety of application fields such as telecommunications, broadcast, automotive, medical, and industrial automation. The ATS-03C-117-C1-R0 is designed to provide a longer component life cycle by regulating temperature and dissipating heat quickly and efficiently. By providing a reliable low-cost solution, it has made thermal management more accessible for a range of applications including those with demanding environmental conditions.

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