| Allicdata Part #: | ATS-03C-126-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-126-C1-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-126-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important for the efficient operation of all kinds of electronic devices, from laptops to home appliances. In order to achieve optimum performance and protect the components inside the device from damage due to overheating, thermal management solutions must be used. Heat sinks are one of the most common solutions, and the ATS-03C-126-C1-R0 is one such heat sink.
The ATS-03C-126-C1-R0 is a thermal management solution for general purpose applications. It uses an aluminum extrusion and a finned design to efficiently dissipate heat away from the device. The extrusion is designed with a “sandwiched” layout, where one layer of aluminum is on top of a second layer of aluminum. This adds to the heat transfer capabilities of the design. The fins are also designed to maximize cooling capacity by replicating natural air convection.
In terms of its application field, the ATS-03C-126-C1-R0 is suitable for a wide variety of components, such as processors, FPGAs, memory modules and power supplies. It is also specifically designed for use with small form factor motherboards. As such, it is well-suited for a wide array of applications that require maximum thermal performance.
The ATS-03C-126-C1-R0 also comes with an integral fan option. This fan helps to further improve the thermal performance of the device. With the optional fan in place, the ATS-03C-126-C1-R0 is capable of cooling components up to 70°C. This makes it a great choice for applications that need to maintain low component temperatures in order to achieve maximum performance.
In terms of working principle, the ATS-03C-126-C1-R0 heat sink uses a combination of natural convection and forced air cooling. The heat generated by the components is dissipated through the fins, which are designed to maximize air flow. The fan, if used, then helps to increase the flow of air through the fins and further improve the thermal performance. This ensures that the components remain at a reasonable operating temperature.
Overall, the ATS-03C-126-C1-R0 is an excellent thermal management solution for a wide variety of electronic devices. It is designed to provide maximum heat transfer while taking up minimal space. The integral fan option further improves the thermal performance of the device, making it ideal for applications where temperature plays an important role. As such, the ATS-03C-126-C1-R0 is a great choice for those requiring a reliable and efficient thermal management solution.
The specific data is subject to PDF, and the above content is for reference