| Allicdata Part #: | ATS-03C-127-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-127-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-127-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are used in a variety of industries to control the temperature of a variety of products. ATS-03C-127-C1-R0 is a type of thermal heat sink, designed for use in applications such as telecommunications, medical, and data centers. In this article, we will discuss the application fields and working principle of the ATS-03C-127-C1-R0 thermal heat sink.
Application Field
The ATS-03C-127-C1-R0 thermal heat sink is designed to be used in a variety of applications, including telecommunications, medical, and data centers. It is ideal for use in tight spaces due to its small form factor and low profile design. It can also be used in applications that require high thermal efficiency due to its optimized fin design. The ATS-03C-127-C1-R0 thermal heat sink also has superior corrosion resistance and durability, making it ideal for outdoor applications as well.
Working Principle
The ATS-03C-127-C1-R0 thermal heat sink works by distributing the heat from a hot component throughout its large surface area, thus lowering the component’s temperature. This is done by using a combination of both convection and conduction techniques. With the convection process, the air around the heat sink is drawn to it due to the heat created by the component, thus cooling it. The conduction process is done by the heat sink itself as it\'s large surface area allows it to easily disperse the heat across to the surrounding air. Both of these processes combined allow for efficient heat dissipation from the hot component and results in lower temperatures.
Conclusion
The ATS-03C-127-C1-R0 thermal heat sink is an efficient and reliable way to control temperatures in a variety of applications. Its low profile design and corrosion resistance make it perfect for tight spaces, outdoor applications, and harsh environments. The heat sink\'s optimized fin design and efficient conduction and convection techniques allow it to quickly dissipate heat from hot components, resulting in lower temperatures and improved performance.
The specific data is subject to PDF, and the above content is for reference