| Allicdata Part #: | ATS6252-ND |
| Manufacturer Part#: |
ATS-03C-134-C2-R0 |
| Price: | $ 7.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-134-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.58350 |
| 10 +: | $ 6.40773 |
| 25 +: | $ 6.05203 |
| 50 +: | $ 5.69596 |
| 100 +: | $ 5.34001 |
| 250 +: | $ 4.98401 |
| 500 +: | $ 4.62801 |
| 1000 +: | $ 4.53900 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are useful pieces of equipment designed to dissipate heat away from components in order to help protect them from damage. The ATS-03C-134-C2-R0 is a thermal heat sink developed by Aviation Tool & Supply and is specifically designed to cope with high temperature, high power multiple-chip applications. This product is used in a wide variety of industries from aerospace, to automotive and power services.
The ATS-03C-134-C2-R0 is designed to efficiently dissipate the heat generated from multi-chip applications. At its core, the design consists of two chambers, the primary chamber and the secondary chamber. The primary chamber is sealed and provides a large thermal conductivity path to the integrated chips while the secondary chamber provides the thermal insulation necessary to ensure the tight temperature tolerance of the integrated chips.
The design of the ATS-03C-134-C2-R0 also includes a number of other features that increase its effectiveness. Key among these are multi-layer fins, which enhance the surface area that can conduct heat away from the components. In addition, the design incorporates a number of liquid channels that significantly increase the thermal transfer rate of the unit. This combination of features enables the ATS-03C-134-C2-R0 to achieve efficient thermal management and highly accurate temperature control of multi-chip applications.
To ensure that the ATS-03C-134-C2-R0 can operate effectively in any application, a number of additional considerations must be taken into account. The first is the type of environment the product will be used in. Different environments will require different types of thermal management. Furthermore, external factors such as airflow and the ambient temperature will impact the effectiveness of the heat sink. Finally, the application’s specific cooling requirements must be considered in order to ensure that the ATS-03C-134-C2-R0 is able to meet the requirements of the application.
The ATS-03C-134-C2-R0 is a specifically designed thermal heat sink that brings efficient thermal management and highly accurate temperature control to multi-chip applications. This heat sink is designed to dissipate the heat generated by multi-chip applications without impacting the performance of the components. It also has features such as multi-layer fins and liquid channels to increase its thermal transfer rate and ensure efficient thermal management. The ATS-03C-134-C2-R0 is an excellent choice for applications that require accurate thermal management, and is used in a wide variety of industries.
The specific data is subject to PDF, and the above content is for reference