| Allicdata Part #: | ATS-03C-14-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-14-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-14-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal technologies have been used for decades in a variety of applications. One of the most widely used thermal technologies is heat sinks. Heat sinks are used to dissipate heat away from a component, typically electronics. The ATS-03C-14-C1-R0 is a type of heat sink that is designed for applications in which thermal management is critical. This article provides an overview of the ATS-03C-14-C1-R0 application field and working principle.
The ATS-03C-14-C1-R0 is a top-of-the-line heat sink designed to provide reliable and efficient thermal management solutions for consumer electronics, automotive, and other industries. It features a high-performance aluminum alloy construction, which provides optimal heat dissipation and durability. The heat sink has a unique, curved profile that can be easily adjusted to fit various applications. Additionally, the heat sink includes multiple fins that are designed to enhance the airflow and disperse the heat even more efficiently.
The ATS-03C-14-C1-R0\'s application field includes a range of applications in which thermal management is critical, including personal computers, smartphones, AV equipment, and automotive systems. This heat sink has been specifically designed for applications in which space is limited, and it can be easily fit into a variety of enclosures. Additionally, the design facilitates easy installation and maintenance, which makes it a great choice for users who don\'t have much experience with electronics.
The ATS-03C-14-C1-R0 operates on the principle of passive cooling, which is a method of cooling that involves the transfer of heat from an area of high temperature (e.g. the component) to an area of lower temperature (the atmosphere). The heat sink utilizes its aluminum alloy construction and multiple fins to dissipate heat away from the component. The fins are designed to enhance the surface area and ensure even heat distribution. Additionally, the heat sink includes a fan to further increase heat transfer and further increase the cooling efficiency. Once the heat is dissipated, it is vented out of the device, thereby keeping the component from overheating.
The ATS-03C-14-C1-R0 offers excellent thermal performance, due to its high-performance aluminum alloy construction and multiple fins. Additionally, the heat sink is designed to facilitate easy installation and maintenance, making it a great choice for users. Finally, the heat sink has a wide application field, which makes it suitable for a variety of applications in which space is limited and thermal management is critical.
The specific data is subject to PDF, and the above content is for reference