| Allicdata Part #: | ATS-03C-145-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-145-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-145-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to transfer heat from one place to another. The ATS-03C-145-C1-R0 is a type of heat sink that comes with specific features and applications.
This heat sink is designed to be used with embedded electronic systems. It provides an efficient way of dissipating the heat generated by these systems. It is designed to be installed on a flat surface and is compact enough to fit in tight spaces. Its design is optimized for low profile applications while providing an optimal heat dissipation ratio.
The ATS-03C-145-C1-R0 is made of a lightweight aluminum alloy that is durable and highly resistant to corrosion. Its construction includes a narrow fin design which maximizes the heat dissipation area while keeping the overall weight of the device relatively low. Its fins are louvered which increases the air flow rate through the heat sink in order to efficiently dissipate the heat generated by electronic systems.
This device is designed to be used in the following applications: embedded systems, automotive, industrial, telecommunication, and consumer electronics. It is an ideal choice for professional applications demanding superior performance and long-term reliability. It is suitable for use with microprocessors, ASICs (application specific integrated circuits), FPGAs (field-programmable gate arrays), and LED lighting.
The ATS-03C-145-C1-R0 relies on a basic thermodynamics concept known as the convective heat transfer. This occurs when heat moves from an object at a higher temperature, to an object of lower temperature. The air is a fluid medium and through convection, it is able to absorb and dissipate heat. The cooler air is drawn in from the bottom of the device while the hot air is expressed through the top. This process increases the efficacy of the device as the heat dissipates quickly and efficiently.
In order to ensure optimal performance, the ATS-03C-145-C1-R0 requires good ventilation and must be mounted in a strategic position. It is important to ensure that the device has an unobstructed air flow both in and out of the device to ensure the best performance. Furthermore, it is important to ensure that the device is mounted properly to ensure that it does not move or shift around when in use.
The ATS-03C-145-C1-R0 is an effective heat sink device that is widely used in various applications. Its body is lightweight and strong and its fin design allows efficient heat dissipation. It is highly reliable and able to work in a wide range of temperatures. It also provides a cost-effective solution for professional embedded systems.
The specific data is subject to PDF, and the above content is for reference