| Allicdata Part #: | ATS6268-ND |
| Manufacturer Part#: |
ATS-03C-149-C2-R0 |
| Price: | $ 4.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-149-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.72330 |
| 10 +: | $ 3.62061 |
| 25 +: | $ 3.41939 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for critical electronic systems to ensure that extreme temperatures do not cause premature component failure. Heat sinks are often used to help dissipate heat away from components to maintain acceptable operating temperatures. The ATS-03C-149-C2-R0 is a type of heat sink designed specifically for thermal management in electronics applications. This article will discuss the application field and working principle of the ATS-03C-149-C2-R0.
The ATS-03C-149-C2-R0 is a specialized heat sink designed for a number of applications, such as telecommunications, military, industrial, medical, and aerospace systems. This particular heat sink is designed with an extruded fin aluminum profile and an integrated fan that can support up to 3,600 rotations per minute. The ATS-03C-149-C2-R0 is capable of dissipating up to 500 watts of heat from an electronic component. Additionally, the heat sink is fully RoHS and REACH compliant, meaning it is free of harmful materials that could corrode or cause environmental damage.
The ATS-03C-149-C2-R0 utilizes the conduction method of thermal management, where heat is dissipated away from the component by direct contact with the heat sink. Heat is conducted from the component into the fins and fan of the heat sink. The fan then draws in air to further dissipate the heat away from the component. This allows the component to remain cool, preventing overheating and potential damage during operation.
The ATS-03C-149-C2-R0 is designed to ensure reliable and efficient thermal management in a variety of applications. The integrated fan is designed to have an extended life span, and the aluminum fins help conduct heat away from the component while remaining lightweight and durable. Additionally, the heat sink is fully compliant with regards to safety and environmental regulations, making it suitable for a variety of applications.
In summary, the ATS-03C-149-C2-R0 is a specialized heat sink designed to provide efficient and reliable thermal management in a variety of electronics applications. The heat sink is designed with an extruded fin aluminum profile and an integrated fan to help dissipate heat away from components to maintain acceptable operating temperatures. The ATS-03C-149-C2-R0 utilizes the conduction method of thermal management, where heat is conducted from the component to the fins and fan of the heat sink. The heat sink is also designed for long-term reliability and compliant with regard to safety and environmental regulations. Thus, the ATS-03C-149-C2-R0 is an ideal choice for efficient and reliable thermal management solutions.
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